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20 of up to 20 (filtered)

Design Engineer, Package Integration

Caterpillar

Lafayette, IN 4 days ago $97,530–$146,290
Actively hiring Confirmed live today Posted this week High trust Below market
Mechanical Engineering Creo Product Design System Integration Fabrication Design APQP NPI CPI NTI Product Development
6+ yrs exp

Senior IC Package Design Engineer

SpaceX

Irvine, CA +1 4 days ago $165,000–$265,000
Actively hiring Confirmed live yesterday Posted this week High trust Competitive pay
IC Package Design ASIC RFIC Power Integrity EM Simulation Cadence APD+ SIP HFSS SIWave ADS BGA Co-packaged Optics Tapeout Substrate Design Mixed Signal silicon floor plan
5+ yrs exp

Senior IC Package Design Engineer

SpaceX

Austin, TX +1 4 days ago
Actively hiring Confirmed live yesterday Posted this week Trusted
IC Package Design ASIC RFIC Cadence APD+ SIP SIWave HFSS ADS Power Integrity EM Simulation BGA Co-packaged Optics Tapeout Substrate Design Mixed Signal
5+ yrs exp

IC Package Design Technical Team Leader

Cisco

San Jose, CA 5 days ago
Actively hiring Confirmed live today Posted this week High trust
ASIC Package Design Signal Integrity (SI) Power Integrity (PI) High-Speed Routing Power Distribution Networks (PDN) EDA Tools Python Perl TCL Shell Programming Oscilloscopes TDR VNA Silicon Floor Planning Tapeout Hardware Development
10+ yrs exp Hybrid

ASIC Package Design Project Manager

Broadcom

Fort Collins, CO 5 days ago $129,400–$207,000
Actively hiring Confirmed live today Posted this week High trust Below market
Package Design ASIC SerDes HBM DDR5 Signal Integrity Power Integrity DFx Thermal Modeling Automation Project Management Layout Simulations RF Microwave ADC DAC
10+ yrs exp

Package Design Methodology Engineer

Nvidia

Remote (Santa Clara, CA) +1 5 days ago $136,000–$218,500
Actively hiring Confirmed live today Posted this week High trust Below market
Python C++ VLSI EDA AI ML LLMs Signal Integrity Power Delivery Parasitic Extraction IC Physical Design Data Structures Algorithms Object-Oriented Design Package Design HPC
5+ yrs exp Remote

IC Package Design Engineer

Apple Inc

San Francisco, CA 7 days ago $184,700–$324,800
Actively hiring Confirmed live yesterday Posted this week High trust Above market
IC Package Design SI/PI Cadence Allegro Mentor Xpedition Calibre CAM350 HFSS PowerSI Python Perl TCL Unix Linux RLGC S-parameters DFM DRC DDR PCIe
10+ yrs exp

IC Package Design Engineer

Apple Inc

Los Angeles, CA 7 days ago $175,000–$308,500
Actively hiring Confirmed live today Posted this week High trust Above market
IC Package Design SI/PI Cadence Allegro Mentor Xpedition Calibre CAM350 HFSS PowerSI Python Perl TCL Unix Linux RLGC S-parameters DFM DRC DDR PCIe
10+ yrs exp

IC Package Design Engineer

Apple Inc

Austin, TX 7 days ago
Actively hiring Confirmed live today Posted this week High trust
IC Package Design Cadence Allegro Mentor Xpedition Calibre CAM350 HFSS PowerSI Python Perl TCL Unix Linux SI/PI RLGC S-parameters DDR PCIe DRC DFM Tape-out
10+ yrs exp

IC Package Design Engineer

Apple Inc

San Francisco, CA 7 days ago $129,300–$225,300
Actively hiring Confirmed live yesterday Posted this week High trust Competitive pay
IC Package Design SI/PI Cadence Allegro Mentor Xpedition Calibre CAM350 HFSS PowerSI Python Perl TCL Unix Linux RLGC S-parameters DRC DFM DDR PCIe

IC Package Design Engineer

Apple Inc

Los Angeles, CA 7 days ago $122,700–$214,300
Actively hiring Confirmed live today Posted this week High trust Below market
IC Package Design Cadence Allegro Mentor Xpedition Python Perl TCL Calibre CAM350 HFSS PowerSI SI/PI) analysis RLGC S-parameters Unix Linux DFM DRC DDR PCIe

IC Package Design Engineer

Apple Inc

Austin, TX 7 days ago
Actively hiring Confirmed live today Posted this week High trust
IC Package Design Cadence Allegro Mentor Xpedition Calibre CAM350 HFSS PowerSI Python Perl TCL Unix Linux SI/PI RLGC S-parameters DDR PCIe DRC DFM Automation

ASIC Package Design Engineer

Broadcom

San Jose, CA +2 8 days ago $143,800–$230,000
Actively hiring Confirmed live today High trust Competitive pay
IC Package Design Flip-chip BGA ASIC SerDes Signal Integrity Power Integrity HBM DDR5 Cadence APD Allegro Package Designer Cadence SKILL Physical Design Layout RF Microwave ADC DAC
10+ yrs exp

Director of Package Design

Microsoft

14 days ago $142,800–$274,800
Actively hiring Confirmed live today High trust Below market
Semiconductor Package Design 2.5D/3D Packaging Chiplet Architecture EDA Tools Cadence Allegro High-Speed Signaling Thermal Co-design FMEA Physical Failure Analysis Silicon Manufacturing Tapeout BGA
8+ yrs exp Hybrid

RF Package Design Engineer, Senior Staff

Qualcomm

San Diego, CA 14 days ago $191,800–$287,800
Actively hiring Confirmed live today High trust Above market
RF Package Design RF Circuit Design Ansys HFSS ADS Hspice Cadence Allegro Mentor Xpedition MatLab Python C++ Perl Electromagnetics Transmission Line Theory Crosstalk
6+ yrs exp

Package Design Engineer

Broadcom

San Jose, CA +2 26 days ago $101,000–$162,000
Actively hiring Confirmed live yesterday Trusted Below market
IC Package Design Flip-chip BGA ASIC SerDes Signal Integrity Power Integrity Thermal Manufacturability Cadence APD Allegro Package Designer Cadence SKILL Physical Design Layout HBM DDR5 RF Microwave ADC DAC
5+ yrs exp

IC Package Design Engineer

Apple Inc

San Francisco, CA 31 days ago $129,300–$225,300
Actively hiring Confirmed live today Trusted Competitive pay
IC Package Design Cadence Allegro Mentor Xpedition Python Perl TCL Calibre CAM350 HFSS PowerSI SI/PI) analysis RLGC S-parameters DRC DFM Unix Linux DDR PCIe

IC Package Design Engineer

Apple Inc

Los Angeles, CA 31 days ago $122,700–$214,300
Actively hiring Confirmed live today Trusted Below market
IC Package Design Cadence Allegro Mentor Xpedition Python Perl TCL HFSS PowerSI Calibre CAM350 SI/PI) analysis RLGC S-parameter Modeling Unix Linux DFM DRC DDR PCIe

IC Package Design Engineer

Apple Inc

Austin, TX 31 days ago
Actively hiring Confirmed live today Low trust
IC Package Design Cadence Allegro Mentor Xpedition Python Perl TCL Calibre CAM350 HFSS PowerSI SI/PI) analysis RLGC S-parameters DDR PCIe Unix Linux DRC DFM Tape-out

IC Package Design Engineer

Apple Inc

San Francisco, CA 31 days ago $184,700–$324,800
Actively hiring Confirmed live today Trusted Above market
IC Package Design SI/PI Cadence Allegro Mentor Xpedition Calibre CAM350 HFSS PowerSI Python Perl TCL Unix Linux RLGC S-parameters DFM DRC DDR PCIe
10+ yrs exp