IC Package Design Technical Team Leader

What you'll do

• Lead complex package design programs from initial concept through implementation and tapeout.
• Optimize package pinouts, stack-ups, power distribution, and high-speed routing for performance and reliability.
• Coordinate with silicon floor planning, signal integrity, and power integrity teams to ensure system-level alignment.
• Manage layout editors and implementation teams to deliver high-quality package layouts.
• Provide technical leadership, direction, and mentorship to the San Jose package design team.
• Develop team capabilities by mentoring engineers to own increasingly complex package programs.
• Enhance package design methodologies and partner with vendors to improve product quality and efficiency.
• Drive innovation in package solutions for next-generation ASIC platforms.

What we're looking for

• Bachelor’s degree in electrical engineering or related field with 12+ years of experience or Master’s degree with 8+ years of experience.
• Experience in high-speed package design, including signal integrity considerations and power distribution networks (PDN).
• Experience with industry-standard EDA tools for package layout and design.
• Experience with technical leadership in complex hardware or silicon development programs.
• Extensive experience in ASIC package design, including pinout optimization and high-speed routing (preferred).
• Knowledge of silicon floor planning and strong collaboration with SI and PI teams (preferred).
• Experience leading or mentoring engineering teams and developing technical talent (preferred).
• Experience with testing and measurement equipment, scripting languages like Python, or coordinating cross-functional hardware programs (preferred).