below marketmost similar roles pay hereabove market
This role pays more than
85%
of similar roles. Most pay
$168,500–$217,525
— the blue band above.
At the midpoint, this role pays about
$240k
versus about
$193k
for comparable roles.
Based on 240 similar postings.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
575 open roles
on FindRole.
Listed pay typically runs
$147,900–$221,900
across 550 roles with salary data.
The RF Package Design Engineer, Senior Staff joins the Packaging Engineering group to lead RF package design and electrical characterization for 6G infrastructure and consumer devices. This senior leadership role involves defining the packaging roadmap, projecting resource needs, and overseeing the development of technical capabilities. Day-to-day responsibilities include collaborating with RF-IC block owners on bump assignments, extracting 3D parasitic models, troubleshooting DC convergence and leakage, and automating design flows. The position requires expertise in electromagnetics, transmission line theory, and crosstalk. Key technologies include Ansys HFSS, Q3D, and SIWave, along with ADS, Hspice, Cadence Allegro, and Mentor Xpedition. Candidates must manage, train, and mentor junior engineers while interacting with cross-functional teams to solve complex RF-IC and system-in-package problems for next-generation mobile phone technologies.