below marketmost similar roles pay hereabove market
This role pays more than
97%
of similar roles. Most pay
$168,500–$227,500
— the blue band above.
At the midpoint, this role pays about
$255k
versus about
$198k
for comparable roles.
Based on 240 similar postings.
Employer
About Apple Inc
Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software
Apple Inc currently has
3497 open roles
on FindRole.
Listed pay typically runs
$174,149–$277,600
across 2702 roles with salary data.
The IC Package Design Engineer joins the Packaging team to define, design, and integrate advanced electronic packaging solutions for internal and custom components. This role involves leading package architecture, driving structure and configuration optimization, and owning physical design from concept through tape-out for SoC, memory, RF, and cellular technologies. Key responsibilities include performing physical layout of package substrates, executing parasitic extraction, and conducting S-parameter modeling to meet Signal and Power Integrity targets. The engineer will utilize Cadence Allegro, Mentor Xpedition, Calibre, CAM350, HFSS, and PowerSI. Candidates must demonstrate proficiency in substrate manufacturing, design for manufacturability, and high-speed interface layout constraints like DDR and PCIe. Additionally, the role requires using Python, Perl, or TCL scripting within Unix/Linux environments to automate design and verification flows.