IC Package Design Engineer

Apple Inc

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Quick summary

Work type: On-site
Location: —
Salary: $122,700–$214,300 / yr
Posted: 6 days ago
Freshness: Confirmed live today

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $206k

This role $168k

$107k most similar roles pay here $265k

This role pays less than 76% of similar roles. Most pay $171,717–$240,550 — the shaded band above. At the midpoint, this role pays about $168k versus about $206k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3513 open roles on FindRole.

Listed pay typically runs $165,800–$277,600 across 2730 roles with salary data.

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At a glance

TL;DR · IC Package Design Engineer

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The IC Package Design Engineer joins the Packaging team to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. This role involves owning package, SiP, and module physical designs from concept through tape-out while optimizing structure and configuration. Key responsibilities include performing physical layout of substrates for diverse silicon, executing parasitic extraction and S-parameter modeling to meet Signal and Power Integrity targets, and developing automated design flows using AI tools. The ideal candidate possesses expertise in Cadence Allegro or Mentor Xpedition, experience with Calibre and CAM350, and a strong understanding of high-speed interface constraints like DDR and PCIe. Technical proficiency includes simulation tools such as HFSS or PowerSI, along with scripting skills in Python, Perl, or TCL within Unix/Linux environments to enhance design efficiency.

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