ASIC Package Design Project Manager

What you'll do

• Create and track project plans for over 20 concurrent package designs including scope, schedules, and resources.
• Improve scheduling methodologies and task tracking systems to ensure projects remain on schedule.
• Organize team and customer activities to maintain project momentum and milestones.
• Communicate project status, upcoming steps, and potential risks to stakeholders.
• Develop technical methodologies for the IC package design process.
• Steer package technology and design rules based on input from team members.
• Manage coordination between customers, vendors, and cross-functional internal teams.

What we're looking for

• Candidates should have previous experience managing package design projects (preferred).
• A Bachelor's degree and 12+ years of related experience are required, or a Master's degree and 10+ years of related experience.
• Knowledge of package-level signal integrity and power integrity is required for application to package designs.
• Technical understanding of the package design lifecycle and how substrates/packages fit into ASIC manufacturing flows is required.
• Proficiency in design data types including .mcm, package spreadsheets, and drawings (POD, Lid, Substrate) is required.
• Understanding of DFx trade-offs, layout SI/PI extractions, simulations, and mechanical/thermal modeling is required.
• Strong self-management, organization, and project management skills are required to track 20+ concurrent designs.
• Ability to collaborate with worldwide teams across multiple time zones and with external vendors is required.