IC Package Design Engineer

Apple Inc

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Quick summary

Work type: On-site
Location: —
Salary: $184,700–$324,800 / yr
Posted: 6 days ago
Freshness: Confirmed live today

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $205k

This role $255k

$132k most similar roles pay here $345k

This role pays more than 96% of similar roles. Most pay $170,652–$239,887 — the shaded band above. At the midpoint, this role pays about $255k versus about $205k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3513 open roles on FindRole.

Listed pay typically runs $165,800–$277,600 across 2730 roles with salary data.

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At a glance

TL;DR · IC Package Design Engineer

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IC Package Design Engineer joins the Packaging team to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. This role involves leading package architecture, optimizing structure and configuration, and owning physical design from concept through tape-out. The engineer will perform physical layout of substrates for diverse silicon, execute parasitic extraction and S-parameter modeling to meet Signal and Power Integrity targets, and collaborate with cross-functional teams on system co-optimization. Key technical requirements include proficiency in Cadence Allegro or Mentor Xpedition, experience with Calibre and CAM350, and knowledge of high-speed interface constraints like DDR and PCIe. The role also requires expertise in HFSS or PowerSI, substrate manufacturing processes, and automation using Python, Perl, or TCL within Unix/Linux environments to enhance design efficiency through automated workflows.

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