IC Package Design Engineer

Apple Inc

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Quick summary

Work type: On-site
Location: —
Salary: $129,300–$225,300 / yr
Posted: 6 days ago
Freshness: Confirmed live today

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Competitive pay

How this pay compares to similar roles

Similar $206k

This role $177k

$115k most similar roles pay here $264k

This role pays less than 66% of similar roles. Most pay $170,652–$240,550 — the shaded band above. At the midpoint, this role pays about $177k versus about $206k for comparable roles.

Based on 240 similar postings.

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3513 open roles on FindRole.

Listed pay typically runs $165,800–$277,600 across 2730 roles with salary data.

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TL;DR · IC Package Design Engineer

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The IC Package Design Engineer joins the Packaging team to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. This role involves leading package architecture, optimizing structure configurations, and managing physical design from concept through tape-out. The engineer will perform physical layout of substrates for diverse integrated circuits while executing parasitic extraction and S-parameter modeling to ensure Signal and Power Integrity performance targets are met. Key responsibilities include collaborating with cross-functional teams on system co-optimization and developing automated design flows using AI tools. Required skills include proficiency in Cadence Allegro or Mentor Xpedition, experience with Calibre and CAM350, and knowledge of high-speed interface constraints like DDR and PCIe. Technical expertise includes Unix/Linux environments and scripting in Python, Perl, or TCL to enhance design efficiency.

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