Director of Package Design

What you'll do

• Lead and mentor a team of package design engineers to support their professional development.
• Drive optimal silicon packaging solutions and chiplet architectures using advanced 2.5D/3D packaging.
• Manage 2.5D/3D packaging product designs from initial definition and development through to tapeout.
• Define and develop test vehicles to validate silicon, package, and system performance.
• Manage suppliers through the definition, development, qualification, and production phases.
• Develop and deliver Failure Mode and Effects Analysis (FMEA) for various technology options.
• Design and develop package and assembly drawings to support manufacturing processes.
• Assess and characterize the reliability of Integrated Circuit (IC) packages.

What we're looking for

• Must have a Doctorate and 3+ years, Master's and 6+ years, or Bachelor's and 8+ years of technical engineering experience in a related field.
• Must be able to meet Microsoft, customer, and government security screening requirements, including a Microsoft Cloud Background Check.
• Must provide proof of citizenship, US residency, or other protected status to access export-controlled information.
• Must be able to access information controlled for export under U.S. ITAR, EAR, EU Dual Use, or other regulations.
• Must have 15+ years of hands-on experience in semiconductor package design, development, manufacturing, supplier management, or quality management (preferred).
• Must have experience with advanced semiconductor package technologies such as BGA, 2.5D, or 3D (preferred).
• Must be proficient in IC package or PCB board layout CAD tools like Cadence Allegro (preferred).
• Must have working knowledge of high-speed signaling, layout, electrical, mechanical, and thermal co-designs (preferred).