Package Design Engineer

What you'll do

• Lead the overall design of ASIC packages, focusing on signal integrity, power integrity, manufacturability, reliability, and thermal performance.
• Design critical package structures for high-speed components including SerDes, ADC/DAC, DDR, and HBM.
• Execute physical design and layout tasks as a foundational responsibility for flip-chip BGA packages.
• Manage project schedules, priorities, and tracking for multiple simultaneous design projects.
• Serve as the primary project manager and customer interface for assigned design projects.
• Develop and implement process improvements, automation, and documentation to increase design team efficiency.
• Coordinate with internal teams and external vendor designers across multiple time zones.

What we're looking for

• BSEE or similar field degree and 5+ years of experience in flip-chip-BGA package design.
• MSEE or similar field degree and 3+ years of work experience.
• Experience in package-level signal integrity and power integrity.
• Experience with Cadence APD (Allegro Package Designer) or an equivalent tool (preferred).
• Experience with Cadence SKILL for Allegro or similar design-automation coding (preferred).
• Ability to work on-site at the Broadcom office 5 days a week.
• Strong self-management, organization, and project management skills.
• Ability to collaborate with worldwide teams across multiple time zones.