Package Design Engineer

What you'll do

• Perform overall design for ASIC packages including signal integrity, power integrity, manufacturability, reliability, and thermal management.
• Design critical structures for high-speed components such as SerDes, ADC/DAC, DDR, and HBM.
• Execute physical layout designs as a foundational component of the engineering process.
• Manage project timelines, priorities, and tracking across multiple simultaneous projects.
• Act as the primary point of contact for customer interface and project management.
• Develop automation, documentation, and process improvements to increase team efficiency.
• Coordinate with internal teams and external vendors across multiple time zones.

What we're looking for

• A BSEE or similar degree with 8+ years of experience in flip-chip-BGA package design is required.
• An MSEE or similar degree with 6+ years of work experience is acceptable.
• Experience must include high-speed SerDes, signal integrity, and power integrity for ASIC packages.
• Proficiency in physical design (layout) is a foundational requirement for this role.
• Experience with Cadence APD (Allegro Package Designer) or an equivalent tool is preferred.
• One or more years of experience with Cadence SKILL or similar design-automation coding is preferred.
• Ability to manage multiple projects simultaneously while coordinating with global teams and vendors.
• Must be able to work on-site at the Broadcom office five days a week.