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Sr. IC Package Design Engineer (Silicon Engineering)

SpaceX

Austin, TX 2 days ago
Actively hiring Posted this week Verified listing
Cadence APD+/SIP SIWave HFSS ADS BGA Co-packaged Optics (CPO) Signal Integrity (SI) Power Integrity (PI) EM simulation Package design electrical review Substrate design RF Digital High-speed and mixed signal die Package/SIP layout

Sr. IC Package Design Engineer (Silicon Engineering)

SpaceX

Irvine, CA 2 days ago $160,000$225,000
Actively hiring Posted this week Verified listing Competitive pay
Cadence APD+/SIP SIWave HFSS ADS BGA Co-packaged Optics (CPO) Signal Integrity (SI) Power Integrity (PI) EM Simulation Package Design Electrical Review Substrate Design RFIC ASIC Manufacturing Reviews

IC Package Mechanical FEA Engineer (R&D)

Broadcom

Fort Collins, CO 4 days ago $108,000$172,800
Actively hiring Posted this week Verified listing Below market
Ansys FEA Mechanical Engineering Strength of Materials Python MATLAB LabVIEW SolidWorks CAD CAE Simulation Testing Validation Documentation Presentation Skills Co-design Multi-project Management Time Zone Collaboration

Package Design Engineer

Broadcom

San Jose, CA 5 days ago $141,300$226,000
Actively hiring Posted this week Verified listing Above market
Cadence APD Allegro Package Designer Signal Integrity Power Integrity Flip-chip BGA SerDes HBM DDR5 Project Management Physical Design/Layout Package Engineering Design Automation Coding Co-design with external vendors Multi-time zone collaboration

Packaged Application Development Manager

Accenture

Charlotte, NC 15 days ago
Actively hiring Verified listing
Java Spring Boot RESTful services XML JSON DevOps Git Jenkins Ansible Kubernetes Splunk New Relic Apache Kafka Agile CI/CD

Senior Package Layout Engineer - Hardware

Nvidia

Remote (Santa Clara, CA) 17 days ago $136,000$212,750
Actively hiring Verified listing Competitive pay
Cadence_APD SiP_tool_suite Constraint_Manager Virtuoso Calibre Valor PCB_layout HDI_design High_speed_design Signal_integrity_practices Python Go Docker CI/CD
Remote

Senior Package Layout Engineer - Hardware

Nvidia

Remote (Santa Clara, CA) 17 days ago $136,000$212,750
Actively hiring Verified listing Competitive pay
Cadence_APD SiP_tool_suite Constraint_Manager Virtuoso Calibre Valor HDI_design PCB_layout Wire_bond_packages Flip_chip_packages
Remote

Package Design Engineer - Up to Staff level

Qualcomm

Santa Clara, CA 17 days ago $154,000$252,800
Actively hiring Competitive pay
Cadence_APD SiP High_speed_IO_interfaces IC_packaging_structures Electromagnetic_field_analysis Flip_chip_BGA 2_5D_Interposer 3D_Interposer Cadence_Allegro PCB_Editor Advanced_Package_Designer XtractIM PowerSI HFSS Q3D Calibre_tool Design_Rules_Check High_speed_layout_constraints DDR PCIe UCIE

IC Package Design Technical Leader

Cisco

Remote (San Jose, CA) 33 days ago $210,600$305,100
Actively hiring Above market
Python Perl TCL shell EDA tools ASIC package design signal integrity power distribution networks SI/PI teams high-speed routing package layout cross-functional collaboration scripting languages VNA analyzers oscilloscopes
Remote

Packaged Application Development Manager

Accenture

Denver, CO 47 days ago $153,600$153,600
Actively hiring Below market
AWS Azure CI/CD GitOps Node.js ReactJS Python Java Message Service (JMS) Dynatrace Linux Informatica DataStage MicroStrategy Agile Containerization DevSecOps SRE Infrastructure and Cloud Automation

Packaged Application Development Manager

Accenture

Albany, NY 68 days ago $130,229$130,229
Actively hiring Below market
Angular React Node.js Express.js MongoDB Oracle PostgreSQL REST APIs SOAP services Git GitLab Jenkins Docker AWS ECS AWS Lambda AWS EventBridge AWS RDS CloudWatch JMeter New Relic Kubernetes

Packaged Application Development Manager

Accenture

Atlanta, GA 78 days ago
Actively hiring
Angular Java Spring JavaScript HTML5 CSS3 RESTful services JSON Agile Jenkins Git Docker Splunk Dynatrace DevOps CI/CD ITIL

IC Package/System Design solution Engineer, Staff

Qualcomm

San Diego, CA 103 days ago $154,000$231,000
Actively hiring Competitive pay
ORCAD Allegro Valor ravel Python PERL TCL PCIe DDR Ethernet SerDes I2C I3C SPI MDIO SIPI PDN PMIC RF前端设计 内存技术 高速信号完整性分析 热管理 合规性测试

Advanced Package Technology Engineer

Broadcom

Fort Collins, CO 143 days ago $120,000$192,000
Actively hiring Verified listing Below market
2.5D 3D BGA Flip Chip Interposer Substrate Design CAD AutoCAD Solidworks APD Thermal Modeling Mechanical Modeling PCB Design Silicon Fabrication Quality Systems Industry Standards Project Management CI/CD