IC Package Integration Lead

The IC Package Integration Lead joins the hardware team to lead package integration and architecture efforts while collaborating with cross-functional teams including Silicon, Packaging, and Systems engineering. This role involves driving package technology development for enhanced performance and lower costs, managing the transition of packaging solutions from concept to high volume manufacturing, and coordinating with assembly partners through NPI and qualification stages. The candidate will create design documentation, rules, and risk assessments while addressing electrical, mechanical, thermal, and reliability requirements. Key technical competencies include experience in semiconductor packaging design, Si floor plans, package layout using Cadence APD or Allegro, signal integrity, power integrity, and material selection. Specialized knowledge in advanced high-density interconnects and cellular, connectivity, or PMU packaging is required to solve complex problems within various form factor and cost constraints.