IC Package Design Engineer

Cisco

Confirmed live yesterday High trust
Remote

Quick summary

Work type
Remote
Location
San Jose, CA
Salary
$152,500–$219,200 / yr
Posted
53 days ago
Freshness
Confirmed live yesterday
Closes
Sep 21, 2026

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $190k
This role $186k
$141k most similar roles pay here $239k

This role pays less than 54% of similar roles. Most pay $162,000–$218,225 — the shaded band above. At the midpoint, this role pays about $186k versus about $190k for comparable roles.

Based on 240 similar postings.

Employer

About Cisco

Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity

Cisco currently has 196 open roles on FindRole.

Listed pay typically runs $167,700–$245,200 across 196 roles with salary data.

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View all roles at Cisco

At a glance

TL;DR · IC Package Design Engineer

IC Package Design Engineer As part of the Common Hardware Group, you will contribute to the development of complex ASIC package designs from early planning through implementation and tapeout. You will perform critical tasks including floorplanning, pinout optimization, stack-up definition, and high-speed routing support while collaborating with SI/PI, silicon floorplanning, layout, and manufacturing teams. The role involves technical problem solving, design reviews, and the development of package design methodologies to ensure robust, manufacturable solutions for advanced networking silicon products. Required skills include experience in high-speed signaling, power delivery, system-level hardware concepts, and industry-standard EDA tools for package or PCB design. Preferred qualifications include expertise in advanced packaging technologies like interposers or multi-die systems, as well as proficiency in scripting languages such as Python, Perl, TCL, or shell to support complex program requirements.

What you'll do

  • Execute package design activities including floorplanning, pinout optimization, stack-up definition, and high-speed routing support.
  • Coordinate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high-quality package solutions.
  • Manage package implementation by working with layout editors to align design intent with physical execution.
  • Participate in technical investigations, design reviews, and trade-off discussions regarding performance and manufacturability.
  • Develop and improve package design methodologies, workflows, and industry best practices.
  • Perform debugging, issue resolution, and package bring-up activities as required.
  • Manage complex package programs and take ownership of large design scopes under senior guidance.

What we're looking for

  • Bachelor's degree with 5+ years of experience or Master's degree with 3+ years of experience in Electrical Engineering or a related field.
  • Experience in hardware, package, PCB, or high-speed design engineering.
  • Experience with high-speed signaling, power delivery, and system-level hardware concepts.
  • Prior experience with industry-standard EDA tools for package or PCB design.
  • Experience in ASIC package design, PCB design, or related high-speed hardware development.
  • Experience with SI/PI concepts and collaboration with cross-functional engineering teams.
  • Experience with advanced packaging technologies, interposers, or multi-die systems is an advantage.
  • Experience with scripting languages such as Python, Perl, TCL, or shell.

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