IC Package Design Engineer

Cisco

Confirmed live today High trust
Hybrid

Quick summary

Work type
Hybrid
Location
San Jose, CA
Salary
$155,000–$222,600 / yr
Employment
Full-time
Posted
39 days ago
Freshness
Confirmed live today
Closes
Nov 30, 2026

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $198k
This role $189k
$140k $248k
below market most similar roles pay here above market

This role pays less than 51% of similar roles. Most pay $168,425–$227,500 — the blue band above. At the midpoint, this role pays about $189k versus about $198k for comparable roles.

Based on 240 similar postings.

Employer

About Cisco

Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity

Cisco currently has 307 open roles on FindRole.

Listed pay typically runs $167,700–$245,000 across 224 roles with salary data.

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View all roles at Cisco

At a glance

TL;DR · IC Package Design Engineer

IC Package Design Engineer The IC Package Design Engineer joins the Common Hardware Group to develop complex ASIC package designs for high-speed networking silicon products. Working within a collaborative engineering environment, the engineer contributes to the full development lifecycle from early planning and exploration through implementation and tapeout. Key responsibilities include floorplanning, pinout optimization, stack-up definition, and high-speed routing support. The role requires collaborating with SI/PI, layout, and manufacturing teams to ensure robust, manufacturable solutions while participating in technical investigations and design reviews. Candidates must possess experience in hardware, package, or PCB design, specifically regarding high-speed signaling and power delivery. Required skills include proficiency with industry-standard EDA tools for package or PCB design, with preferred experience in advanced packaging technologies, interposers, multi-die systems, and scripting languages like Python, Perl, TCL, or shell.

What you'll do

  • Execute package design activities including floorplanning, pinout optimization, stack-up definition, and high-speed routing support.
  • Coordinate with SI/PI, silicon floorplanning, layout, and manufacturing teams to deliver high-quality package solutions.
  • Support package implementation by working with layout editors to align design intent with physical implementation.
  • Participate in technical investigations, design reviews, and tradeoff discussions regarding performance, manufacturability, and schedules.
  • Develop and improve package design methodologies, flows, and industry best practices.
  • Perform debugging, issue resolution, and package bring-up activities as required.
  • Manage complex package programs and take ownership of large design scopes under the guidance of senior engineers.

What we're looking for

  • Bachelor's degree with 5+ years of experience or Master's degree with 3+ years of experience in Electrical Engineering or a related field.
  • Experience in hardware, package, PCB, or high-speed design engineering.
  • Experience with high-speed signaling, power delivery, and system-level hardware concepts.
  • Prior experience with industry-standard EDA tools for package or PCB design.
  • Experience in ASIC package design, PCB design, or related high-speed hardware development (preferred).
  • Experience with SI/PI concepts and collaboration with cross-functional engineering teams (preferred).
  • Experience with advanced packaging technologies, interposers, or multi-die systems (preferred).
  • Experience with scripting languages such as Python, Perl, TCL, or shell (preferred).

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