Quick summary
- Work type
- On-site
- Location
- —
- Salary
- $184,700–$324,800 / yr
- Posted
- 16 days ago
- Freshness
- Confirmed live yesterday
Market check
Salary context
How this pay compares to similar roles
This role pays more than 92% of similar roles. Most pay $146,100–$218,000 — the shaded band above. At the midpoint, this role pays about $255k versus about $182k for comparable roles.
Based on 240 similar postings.
Employer
About Apple Inc
Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software
Apple Inc currently has 3513 open roles on FindRole.
Listed pay typically runs $165,800–$277,600 across 2730 roles with salary data.
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At a glance
TL;DR · IC Package Integration Lead
The IC Package Integration Lead joins the engineering team to lead package integration and architecture efforts while collaborating with cross-functional teams including Silicon, Packaging, and Systems engineering. This role involves driving package technology development, managing co-design efforts to meet electrical, mechanical, thermal, and reliability requirements, and overseeing the transition of innovative packaging solutions from concept through high volume manufacturing. The candidate will work with assembly partners and OSAT providers to develop new packages, modules, and technologies while creating design documentation and risk assessments. Key technical competencies include experience in semiconductor packaging design, Si floor plan, package layout using Cadence APD or Allegro, signal and power integrity, and thermal management. Specialized knowledge in cellular, connectivity, and PMU packaging is desired to solve complex problems regarding high density interconnects and various form factor constraints.
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