below marketmost similar roles pay hereabove market
This role pays less than
58%
of similar roles. Most pay
$162,000–$238,975
— the blue band above.
At the midpoint, this role pays about
$182k
versus about
$200k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
510 open roles
on FindRole.
Listed pay typically runs
$172,000–$258,000
across 510 roles with salary data.
The Advanced Package Thermal Technologist serves as a Package-centric Thermal Modeling Architect, driving next-generation packaging-platform architectures through model-based decision making and System-Technology Co-Optimization. The role involves developing, validating, and applying thermal, thermo-mechanical, electro-thermal, and electro-optical models to guide SoC, package, and board-level architecture and technology selection. Key responsibilities include defining strategic directions for thermal technology development, assessing technology readiness, and influencing product roadmaps for data center and high-performance computing systems. The position requires expertise in CFD first-principles, advanced PCB technologies, SMT processes, and connectors. Candidates must demonstrate skills in correlating simulations with physical test data and familiarity with AI/ML-based engineering workflows, such as surrogate modeling and automated optimization pipelines, to solve complex multi-physics design and assembly trade-offs.
Drive model-based architecture and design decisions for advanced package technologies.
Develop and maintain thermal and multi-physics models for silicon, package, and board levels.
Define validation strategies and partner with labs to enable System-Technology Co-Optimization.
Align material properties and process capabilities with suppliers and component vendors.
Define strategic targets for thermal and package technology development to influence product roadmaps.
Serve as a thermal subject-matter expert for data center and high-performance computing platforms.
Correlate simulation results with physical test data to validate modeling assumptions.
What we're looking for
MS or PhD in relevant Engineering disciplines or physics.
Demonstrated experience owning and driving model-based architecture and design decisions supported by SoC, package, and system-level thermal modeling (preferred).
Solid foundation in Thermal and CFD first-principles understanding and multi-physics SoC-package-system-level design and assembly trade-offs (preferred).
Strong background in advanced PCB technologies, including materials, designs, and assembly constraints (preferred).
Experience integrating electro-thermal and electro-optical technologies at the board and package level (preferred).
Experience influencing SMT processes, connectors, and assembly strategies from an architecture and modeling perspective (preferred).
Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles (preferred).
Track record of influencing experimental test plans and correlating simulation with physical test data (preferred).