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20 of up to 20 (filtered)

Process Engineer IV

Lam Research

Tualatin, OR 2 days ago
Actively hiring Confirmed live yesterday Posted this week Trusted
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Material Characterization Plasma Physics
6+ yrs exp

Field Process Engineer IV

Lam Research

Hillsboro, OR 10 days ago
Actively hiring Confirmed live yesterday Trusted
Statistical Process Control (SPC) Design of Experiments (DOE) Root Cause Analysis Data Analysis Continuous Improvement Plan (CIP)
6+ yrs exp

Field Process Engineer IV

Lam Research

Hillsboro, OR 16 days ago
Actively hiring Confirmed live yesterday Trusted
Statistical Process Control (SPC) Design of Experiments (DOE) Root Cause Analysis Data Analysis Continuous Improvement Plan (CIP) Presentation Software
6+ yrs exp

Process Engineer IV

Applied Materials

Santa Clara, CA 22 days ago $147,000$202,500
Actively hiring Confirmed live yesterday Trusted Above market
CVD Plasma Processing Semiconductor Manufacturing Hardware Characterization Plasma Physics Process Engineering

Field Process Engineer IV

Lam Research

Hillsboro, OR 35 days ago
Actively hiring Confirmed live 2 days ago Low trust
Statistical Process Control (SPC) Design of Experiments (DOE) Root Cause Analysis Data Analysis Continuous Improvement Plan (CIP) Etch Deposition
6+ yrs exp

Field Process Engineer IV

Lam Research

Austin, TX 39 days ago
Actively hiring Confirmed live 2 days ago Low trust
Statistical Process Control (SPC) Design of Experiments (DOE) Root Cause Analysis Data Analysis Continuous Improvement Plan (CIP)
6+ yrs exp

Field Process Engineer IV

Lam Research

Boise, ID 42 days ago
Actively hiring Confirmed live yesterday Low trust
Statistical Process Control (SPC) Design of Experiments (DOE) Root Cause Analysis Data Analysis Continuous Improvement Plan (CIP) Excel Word
6+ yrs exp

Process Engineer IV

Lam Research

Fremont, CA 46 days ago $104,000$231,000
Actively hiring Confirmed live 2 days ago Trusted Competitive pay
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Material Characterization Surface Engineering
6+ yrs exp

Field Process Engineer IV

Lam Research

Hillsboro, OR 46 days ago
Actively hiring Confirmed live 2 days ago Low trust
Statistical Process Control (SPC) Design of Experiments (DOE) Root Cause Analysis Data Analysis Continuous Improvement Plan (CIP)
6+ yrs exp

Field Process Engineer IV

Lam Research

Chandler, AZ 51 days ago
Actively hiring Confirmed live yesterday Low trust
Etch Statistical Process Control (SPC) Design of Experiments (DOE) Root Cause Analysis Data Analysis Continuous Improvement Plan (CIP)
6+ yrs exp

Process Engineer IV

Lam Research

Fremont, CA 53 days ago $104,000$231,000
Actively hiring Confirmed live yesterday Low trust Competitive pay
Statistical Process Control Design of Experiments MATLAB Python JMP Minitab Atomic Layer Deposition Chemical Vapor Deposition Physical Vapor Deposition Reactive Ion Etching Atomic Layer Etching Inductively Coupled Plasma Capacitively Coupled Plasma Material Characterization
6+ yrs exp

Process Engineer IV

Lam Research

Fremont, CA 56 days ago $104,000$231,000
Actively hiring Confirmed live yesterday Low trust Competitive pay
Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Material Characterization
6+ yrs exp

Field Process Engineer IV

Lam Research

Hillsboro, OR 64 days ago
Actively hiring Confirmed live yesterday Low trust
Statistical Process Control (SPC) Design of Experiments (DOE) Root Cause Analysis Data Analysis Continuous Improvement Plan (CIP)
6+ yrs exp

Process Engineer IV

Lam Research

Fremont, CA 71 days ago $104,000$231,000
Actively hiring Confirmed live 2 days ago Low trust Competitive pay
Statistical Process Control Design of Experiments MATLAB Python JMP Minitab Atomic Layer Deposition Chemical Vapor Deposition Physical Vapor Deposition Reactive Ion Etching Atomic Layer Etching Inductively Coupled Plasma Capacitively Coupled Plasma Material Characterization
6+ yrs exp Hybrid

Field Process Engineer IV

Lam Research

Hillsboro, OR 76 days ago
Actively hiring Confirmed live 2 days ago Low trust
Statistical Process Control (SPC) Design of Experiments (DOE) Root Cause Analysis Data Analysis Continuous Improvement Plan (CIP)
6+ yrs exp

Process Engineer IV

Lam Research

Tualatin, OR 77 days ago
Actively hiring Confirmed live yesterday Low trust
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Material Characterization Surface Engineering Plasma Physics
6+ yrs exp

Field Process Engineer IV

Lam Research

Chandler, AZ 78 days ago
Actively hiring Confirmed live 2 days ago Low trust
Statistical Process Control (SPC) Design of Experiments (DOE) Root Cause Analysis Data Analysis Continuous Improvement Plan (CIP)
6+ yrs exp

Process Engineer IV

Lam Research

Fremont, CA 78 days ago $104,000$231,000
Actively hiring Confirmed live 2 days ago Low trust Competitive pay
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) MATLAB Python JMP Minitab Statistical Process Control (SPC) Design of Experiments (DOE) Material Characterization Surface Engineering Plasma Physics
6+ yrs exp Hybrid