Principal Subsystem Design Engineer
Microsoft
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How this pay compares to similar roles
This role pays more than 68% of similar roles. Most pay $173,371–$225,075 — the shaded band above. At the midpoint, this role pays about $209k versus about $199k for comparable roles.
Based on 240 similar postings.
Employer
Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing
Microsoft currently has 598 open roles on FindRole.
Listed pay typically runs $119,800–$234,700 across 586 roles with salary data.
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The Principal Design Engineer joins the Artificial Intelligence System on Chip (AISoC) Silicon team within the Cloud Hardware, and Infrastructure Engineering group. In this role, you will drive high performance and high bandwidth designs by focusing on Intellectual Property microarchitecture specification, Register Transfer Level design, synthesis, and System on Chip integration across various subsystems. You will collaborate with architecture, verification, and physical design teams to ensure implementations meet specific requirements. The position requires expertise in Verilog, System Verilog, and Clock Domain Crossing closure, alongside experience in Synthesis, Timing constraints, Power, Performance, Area trade-offs, and Post-Silicon Debug. You will work on complex algorithmic designs for AI usages, Fabric or Network On Chip designs, and potentially CPU or graphics core designs to solve technical challenges within the specialized domain of AI silicon infrastructure.
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