Principal Design Engineer
Microsoft
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How this pay compares to similar roles
This role pays more than 73% of similar roles. Most pay $155,998–$214,000 — the shaded band above. At the midpoint, this role pays about $209k versus about $185k for comparable roles.
Based on 240 similar postings.
Employer
Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing
Microsoft currently has 598 open roles on FindRole.
Listed pay typically runs $119,800–$234,700 across 586 roles with salary data.
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At a glance
The Principal Subsystem Design Engineer joins the Artificial Intelligence System on Chip team within the Silicon, Cloud Hardware, and Infrastructure Engineering group. This role provides technical leadership for Memory Subsystem development, driving solutions from architecture and microarchitecture through silicon bring-up. The engineer will design, integrate, and verify high-performance SoC subsystems while collaborating with cross-functional teams to resolve system-level issues. Key responsibilities include optimizing architectures involving PCIe, HBM, interconnect fabrics, AMBA AXI/CHI protocols, DMA engines, and NoCs. The role requires expertise in Verilog, SystemVerilog, and scripting languages like Python or Perl to perform RTL development, synthesis, and timing constraints. This position focuses on the technical challenge of developing high-performance, scalable hardware for cloud infrastructure, specifically addressing memory technologies, bandwidth, latency, power efficiency, and performance optimization within complex Artificial Intelligence and Machine Learning SoC environments.
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