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11 of up to 20 (filtered)

Manager Programs 2, Advanced Packaging

Northrop Grumman

Apopka, FL 8 days ago $139,100–$208,700
Actively hiring Confirmed live today High trust Competitive pay
Microelectronics Semiconductor Engineering Advanced Packaging Wafer Post-Processing Earned Value Management (EVM) Agile FAR DFARS Capture Planning Materials Science Electrical Engineering
8+ yrs exp
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Process Integrator, Advanced Packaging & Co-Packaged Optics R&D

Applied Materials

Albany, NY +1 14 days ago $176,000–$242,000
Actively hiring Confirmed live today High trust Above market
Co-Packaged Optics (CPO) Silicon Photonics Photonic Integrated Circuits Heterogeneous Integration Advanced Packaging 2.5D/3D Integration Wafer-to-Wafer Bonding Lithography Deposition Etch CMP Metrology Failure Analysis DOE TSVs Chiplets Fiber Attach Thermal Management
5+ yrs exp
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Hardware Intern, Advanced Packaging

IBM

Yorktown Heights, NY 33 days ago
Actively hiring Confirmed live today High trust
SMT Assembly Laser Soldering Laminate Design Laser Assisted Bonding (LAB) Laser Assisted Reflow (LAR) High-Performance Computing Quantum Computing AI Hybrid Cloud Soldering Alloys Physics Mechanical Engineering
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Advanced Packaging Technologist, Mechanical Modeling

Amd

Austin, TX 35 days ago $145,360–$218,040
Actively hiring Confirmed live today High trust Competitive pay
Mechanical Modeling Multi-physics Modeling FEA System-Technology Co-Optimization (STCO) SMT Electro-thermal Electro-optical Failure Analysis Reduced-order Modeling DOE
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Staff Failure Analysis Engineer, Advanced Packaging Technologies

Qualcomm

San Diego, CA 40 days ago $141,300–$211,900
Actively hiring Confirmed live today High trust Competitive pay
Failure Analysis Hardware Design Thermal Management Signal Integrity ATE Socketing Technologies Electrical Engineering Power Delivery Thermal Analysis Electrical Analysis Hardware Specifications Silicon on Dock (SOD)
4+ yrs exp
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Capital Equipment Hardware Engineer, Advanced Packaging

Applied Materials

Santa Clara, CA 49 days ago $124,000–$171,000
Actively hiring Confirmed live today High trust Below market
Semiconductor Manufacturing Hybrid Bonding Advanced Packaging Vacuum Systems Plasma Processing Metrology Systems Automated Material Handling Wet Processing Electrical Engineering Mechanical Engineering Mechatronics Systems Engineering root-cause analysis Preventative Maintenance Tool Installation
3+ yrs exp
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Manager Programs 2, Advanced Packaging

Northrop Grumman

Linthicum, MD 70 days ago $153,800–$230,800
Actively hiring Confirmed live today Low trust Competitive pay
Microelectronics Advanced Packaging Semiconductors Earned Value Management (EVM) Agile FAR DFAR IRAD CRAD Program Management Risk Management Cost & Schedule Control Prototyping Manufacturing
8+ yrs exp
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Advanced Packaging Integration Engineer

Applied Materials

Santa Clara, CA 91 days ago $161,000–$221,000
Actively hiring Confirmed live yesterday High trust Competitive pay
Advanced Packaging Hybrid Bonding 2.5D/3D Heterogeneous Integration Semiconductor Processing TSV RDL Underfill Bumping Molding OSAT Processes Micro-LED CPO Design of Experiments SPC JMP MES Statistical Data Analysis Process Optimization
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Director, Advanced Packaging Disruptive Technology

Applied Materials

Singapore, Singapore +5 124 days ago
Actively hiring Confirmed live today High trust
Advanced Packaging Heterogeneous Integration Chiplet Ecosystems D2W RDL CoWoS TSV Semiconductor Technology Materials Science Electrical Engineering Mechanical Engineering Physics R&D System Architecture HPC AI
10+ yrs exp
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