below marketmost similar roles pay hereabove market
This role pays more than
69%
of similar roles. Most pay
$147,500–$227,300
— the blue band above.
At the midpoint, this role pays about
$209k
versus about
$187k
for comparable roles.
Based on 240 similar postings.
Employer
About Applied Materials
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has
337 open roles
on FindRole.
Listed pay typically runs
$124,000–$171,000
across 219 roles with salary data.
JOB TITLE: Process Integrator Advanced Packaging & Co-Packaged Optics R&D
The Process Integrator Advanced Packaging & Co-Packaged Optics R&D joins the R&D team to lead the development and integration of advanced semiconductor packaging modules. This role involves connecting unit processes, materials, device requirements, metrology, and reliability into robust integrated flows. You will own end-to-end process integration for photonic integrated circuits, electronic ICs, optical engines, interposers, and substrates. Key responsibilities include developing process windows, control plans, and learning-cycle strategies while translating optical, electrical, thermal, and mechanical requirements into measurable success criteria. You will utilize skills in bonding, lithography, deposition, etch, CMP, and failure analysis to solve complex co-packaged optics integration risks like contamination, warpage, and thermal-mechanical stress. The role requires expertise in silicon photonics, 2.5D/3D integration, and fine-pitch interconnects to achieve stable module performance.
Own end-to-end process integration for advanced packaging and heterogeneous integration programs from concept to technology transfer.
Develop integrated process flows for photonic integrated circuits, electronic ICs, and optical engines including module sequences and control plans.
Translate optical, electrical, thermal, and mechanical requirements into measurable process-integration specifications and success criteria.
Lead cross-functional execution across photonics, bonding, lithography, deposition, etch, metrology, and reliability teams.
Drive integration of photonic and electronic dies, including die-to-wafer bonding, fine-pitch interconnects, and optical coupling.
Design and execute structured experiments and DOEs to optimize optical loss, coupling efficiency, and thermal behavior.
Identify and resolve integration risks such as contamination, bonding defects, warpage, and thermal-mechanical stress.
Create technology roadmaps, risk assessments, and executive-ready reports to communicate progress to senior leaders and customers.
What we're looking for
MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Applied Physics, Photonics, or a related technical field.
5–10 years of experience in a semiconductor process integrator or process-integration role with substantial R&D or advanced technology development experience.
Demonstrated experience building and executing integrated semiconductor or photonics process flows involving multiple process modules and cross-functional engineering teams.
Strong understanding of CPO, silicon photonics, photonic integrated circuits, optical engines, or optical/electrical heterogeneous integration.
Working knowledge of photonic and electronic die integration, optical coupling and alignment, fiber attach interfaces, fine-pitch interconnects, and advanced substrate or interposer integration.
Understanding of optical loss, alignment tolerances, thermal management, thermal-mechanical interactions, packaging-induced stress, defect mechanisms, metrology, characterization, and reliability.
Experience planning experiments, applying statistical analysis and DOE methods, interpreting optical, electrical, physical, and reliability datasets, and converting results into clear technical decisions.
Proven ability to lead technically complex R&D projects with ambiguity, risk, and interdependencies while maintaining execution discipline.