below marketmost similar roles pay hereabove market
This role pays more than
57%
of similar roles. Most pay
$138,612–$231,625
— the blue band above.
At the midpoint, this role pays about
$191k
versus about
$185k
for comparable roles.
Based on 240 similar postings.
Employer
About Applied Materials
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has
272 open roles
on FindRole.
Listed pay typically runs
$124,000–$171,000
across 188 roles with salary data.
The Advanced Packaging Integration Engineer joins the Photonics Platform Business Group to work with a cross-functional research team developing advanced packaging solutions for next-generation smart glasses and high-performance optical interconnects. This role leads process integration for micro-LED panels and high-performance interconnects, architecting scalable integration flows that meet manufacturability and reliability requirements. Key responsibilities include defining and optimizing flows such as hybrid bonding, 2.5D/3D heterogeneous integration, TSV, RDL, underfill, bumping, and molding. The engineer must design experiments, perform root-cause analysis, and collaborate with fabs, OSATs, and internal metrology teams. Required expertise includes semiconductor processing and statistical data analysis using Design of Experiments, SPC, and JMP. Candidates should possess a STEM degree and experience in advanced packaging technologies to solve complex manufacturing and reliability challenges.
Define, develop, and optimize advanced packaging process integration flows for high-performance interconnects and micro-LED panels.
Architect robust and scalable integration flows that meet specific manufacturability and reliability requirements.
Own and manage complex technical projects to ensure high-quality, on-time delivery.
Design experiments and systematically collect and analyze data to drive root-cause analysis and corrective actions.
Collaborate with foundries, OSATs, and internal research teams to implement improved integration strategies.
Work with design, process, integration, and metrology teams to deliver production-ready solutions.
Stay updated on field advancements to drive continuous technology innovation.
What we're looking for
Ph.D. or M.S. degree in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM field.
In-depth knowledge and hands-on experience in advanced packaging technologies including hybrid bonding, semiconductor processing, and 2.5D/3D integration.
Experience with TSV, RDL, underfill, bumping, molding, and OSAT processes.
Proficient in statistical data analysis and process optimization and control techniques such as Design of Experiments, SPC, and JMP.
Strong communication and interpersonal skills to collaborate effectively across multidisciplinary teams.
Self-starter with strong problem-solving skills and the ability to work independently or in team environments.
Micro-LED or CPO experience (preferred).
Coding capability, experience with MES systems, and ability to prepare executive-level presentations (preferred).
Semiconductor Packaging Design
SiP Packaging
Cadence APD
Allegro
Signal Integrity
Power Integrity
Design for Manufacturing
NPI
Package Layout
Si Floor Plan
Process & Technology Development
reliability, testing
BOM
HVM