Staff Failure Analysis Engineer, Advanced Packaging Technologies

Qualcomm

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$141,300–$211,900 / yr
Posted
16 days ago
Freshness
Confirmed live yesterday
Closes
Mar 16, 2027

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $198k
This role $177k
$131k most similar roles pay here $241k

This role pays less than 65% of similar roles. Most pay $170,000–$226,562 — the shaded band above. At the midpoint, this role pays about $177k versus about $198k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 564 open roles on FindRole.

Listed pay typically runs $152,130–$222,500 across 550 roles with salary data.

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At a glance

TL;DR · Staff Failure Analysis Engineer, Advanced Packaging Technologies

Staff Failure Analysis Engineer - Advanced Packaging Technologies joins the Hardware Engineering team to lead the development of failure analysis test interfaces, advanced socketing, and thermal management solutions for Electrical Fault Isolation. This role involves designing and deploying custom sockets, carrier boards, and thermal management systems tailored for high-power devices across mobile, compute, automotive, networking, and AR/VR platforms. The engineer will define hardware specifications, evaluate performance using thermal and electrical analysis tools, and collaborate with cross-functional teams to ensure robust fault isolation for large package sizes and high pin counts. Key technical competencies include expertise in socketing technologies, power delivery challenges, signal integrity for advanced semiconductor packages, and thermal mitigation techniques. This role addresses the challenge of traditional design flows when faced with complex SoCs and emerging packaging trends in modern electronics.

What you'll do

  • Lead the development and enablement of FA test interfaces across all Qualcomm product lines.
  • Plan, develop, and deploy custom sockets and carrier boards for ATE-based and platform-based testing.
  • Define and optimize the minimum viable set of socket and interface variants to ensure hardware readiness by Silicon on Dock.
  • Design and deploy thermal management solutions tailored for high-power devices in Cloud, Compute, and Automotive segments.
  • Use thermal and electrical analysis tools to evaluate the performance and reliability of FA hardware solutions.
  • Create detailed hardware specifications to integrate socketing and thermal solutions into the FA workflow.
  • Evaluate emerging technologies and packaging trends to evolve FA interface and socketing strategies.

What we're looking for

  • Bachelor's degree in a related field and 4+ years of hardware engineering experience.
  • Master's degree in a related field and 3+ years of hardware engineering experience.
  • PhD in a related field and 2+ years of hardware engineering experience.
  • Experience with advanced socketing, power delivery challenges, and signal integrity for semiconductor packages (preferred).
  • Experience supporting FA or debug activities for complex SoCs or high-pin-count devices (preferred).
  • Familiarity with thermal analysis and mitigation techniques for high-power semiconductor devices (preferred).
  • Ability to translate technical requirements into actionable hardware specifications (preferred).
  • Strong collaboration skills to work across multidisciplinary and global teams (preferred).

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