Senior Physical Failure Analysis Engineer
Nvidia
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How this pay compares to similar roles
This role pays less than 65% of similar roles. Most pay $170,000–$226,562 — the shaded band above. At the midpoint, this role pays about $177k versus about $198k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 564 open roles on FindRole.
Listed pay typically runs $152,130–$222,500 across 550 roles with salary data.
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At a glance
Staff Failure Analysis Engineer - Advanced Packaging Technologies joins the Hardware Engineering team to lead the development of failure analysis test interfaces, advanced socketing, and thermal management solutions for Electrical Fault Isolation. This role involves designing and deploying custom sockets, carrier boards, and thermal management systems tailored for high-power devices across mobile, compute, automotive, networking, and AR/VR platforms. The engineer will define hardware specifications, evaluate performance using thermal and electrical analysis tools, and collaborate with cross-functional teams to ensure robust fault isolation for large package sizes and high pin counts. Key technical competencies include expertise in socketing technologies, power delivery challenges, signal integrity for advanced semiconductor packages, and thermal mitigation techniques. This role addresses the challenge of traditional design flows when faced with complex SoCs and emerging packaging trends in modern electronics.
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