This role pays less than
81%
of similar roles. Most pay
$152,693–$213,375
— the shaded band above.
At the midpoint, this role pays about
$148k
versus about
$183k
for comparable roles.
Based on 240 similar postings.
Employer
About Applied Materials
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has
128 open roles
on FindRole.
Listed pay typically runs
$132,750–$182,500
across 128 roles with salary data.
Capital Equipment Hardware engineer - Advanced Packaging serves as a Global Product Support Engineer supporting the installation, startup, qualification, and ongoing operation of the Kinex Hybrid Bonding platform. This role involves managing the system from initial dock through process readiness by coordinating with facilities, engineering teams, and vendors. The engineer performs hands-on troubleshooting of mechanical, electrical, automation, and process issues while developing preventative maintenance procedures and analyzing reliability trends. Key responsibilities include facility data sheet development, utility requirement validation, and supporting hybrid bonding process development for die-to-wafer and wafer-to-wafer applications. Required skills include root cause analysis and experience with semiconductor manufacturing equipment. The role addresses technical challenges in advanced packaging, specifically focusing on optical interconnects and next-generation heterogeneous integration. Candidates should possess expertise in vacuum systems, plasma processing, wet clean processes, and automated material handling systems.
MES
DMAIC
Root Cause Analysis
FMEA
RCFA
Project Management
System Integration
Commissioning
Process Improvement
Automation
change-management
Capital Projects
3D X-ray
Semiconductor Manufacturing
Metrology
Failure Analysis
X-ray CT
SEM
FIB
Advanced Packaging
Microscopy
Data Acquisition
Tool Characterization
Physics
Electrical Engineering
Process Development