below marketmost similar roles pay hereabove market
This role pays less than
85%
of similar roles. Most pay
$160,000–$216,250
— the blue band above.
At the midpoint, this role pays about
$148k
versus about
$188k
for comparable roles.
Based on 240 similar postings.
Employer
About Applied Materials
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has
337 open roles
on FindRole.
Listed pay typically runs
$124,000–$171,000
across 219 roles with salary data.
The Capital Equipment Hardware engineer - Advanced Packaging joins the Global Product Support team to support the installation, startup, qualification, and ongoing operation of the Kinex Hybrid Bonding platform. This role involves bringing the system from installation through process readiness by coordinating with Facilities, BESI, and product engineering teams. Key responsibilities include troubleshooting mechanical, electrical, automation, and process-related issues, developing preventative maintenance procedures, and managing vendor engagement. The engineer will support die-to-wafer hybrid bonding, optical interconnect, and next-generation heterogeneous integration development. Candidates must possess a BS in Mechanical, Electrical, Mechatronics, or Systems Engineering and 3–7 years of semiconductor equipment experience. Required skills include root-cause analysis and troubleshooting, with preferred knowledge of vacuum systems, plasma processing, wet processing, and automated material handling systems.