This role pays more than
63%
of similar roles. Most pay
$158,000–$202,500
— the shaded band above.
At the midpoint, this role pays about
$192k
versus about
$180k
for comparable roles.
Based on 240 similar postings.
Employer
About Northrop Grumman
Northrop Grumman is a leading global aerospace and defense technology company providing systems in autonomous systems, cyber, C4ISR, space, strike, and logistics. Industry: Aerospace & Defense
Northrop Grumman currently has
367 open roles
on FindRole.
Listed pay typically runs
$114,900–$176,300
across 353 roles with salary data.
Manager Programs 2 - Advanced Packaging joins the Advanced Packaging team within the Northrop Grumman Microelectronics Center to support the Foundry, Test, and Advanced Packaging Operating Unit. This role is responsible for the lifecycle management of advanced packaging technology development, prototyping, and maturation programs. The individual will manage cost, schedule, and technical performance while leading cross-functional Integrated Program Teams to meet requirements for next-generation defense systems. Key responsibilities include developing business opportunities through strategic planning, managing supplier relationships, and overseeing contract negotiations and risk management. The role requires expertise in Earned Value Management (EVM), integrated scheduling, and Agile methodologies. Candidates must possess technical experience in microelectronics and advanced packaging technologies to solve complex problems related to the development and deployment of high-performance components for defense and commercial applications within a highly regulated manufacturing environment.
Manage cost, schedule, and technical performance for advanced packaging technology development and maturation programs.
Lead cross-functional Integrated Program Teams to meet specific program objectives and requirements.
Develop new business opportunities through strategic planning, capture planning, and proposal development.
Cultivate customer relationships to identify growth opportunities and support value creation strategies.
Manage contract negotiations, including changes to specifications, operating budgets, and schedule milestones.
Track and report program performance using Earned Value Management (EVM) or similar cost control tools.
Conduct risk and opportunity management practices to identify and mitigate potential project issues.
Oversee the full program lifecycle from initial proposal development through contract closeout.
What we're looking for
U.S. Citizenship is required.
Active U.S. Government Secret clearance is required.
Bachelor’s degree with 8+ years experience, Master’s with 6+ years, or PhD with 3+ years of relevant experience is required.
Demonstrated experience leading teams to perform tasks on schedule and at cost as a project lead or program manager is required.
Technical experience supporting the research, development, production, and deployment of microelectronics and advanced packaging technologies is required.
Experience using Earned Value Management (EVM), integrated schedules, and Agile methodologies for performance tracking and risk management is required.
Strong verbal and written communication skills for developing white papers, proposals, and technical presentations are required.
Advanced degree in a science or technology field related to microelectronics, Top Secret clearance, or familiarity with FAR/DFAR are preferred.
Earned Value Management (EVM)
EVMS
Integrated Master Plan (IMP)
Integrated Master Schedule (IMS)
Risk and Opportunity Management
Proposal Development
Scope Control
Change Management
STEM
Earned Value Management (EVM)
Microsoft Project
RF Systems
FAR
DFARS
CPIF
FPIF
FFP
IRAD
CRAD
Program Management
Proposal Development
Integrated Program Teams (IPT)