Manager Programs 2, Advanced Packaging

Northrop Grumman

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Quick summary

Work type
On-site
Location
Linthicum, MD
Salary
$153,800–$230,800 / yr
Employment
Full-time
Posted
70 days ago
Freshness
Confirmed live today

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $178k
This role $192k
$132k $241k
below market most similar roles pay here above market

This role pays more than 63% of similar roles. Most pay $153,500–$202,362 — the blue band above. At the midpoint, this role pays about $192k versus about $178k for comparable roles.

Based on 240 similar postings.

Employer

About Northrop Grumman

Northrop Grumman is a leading global aerospace and defense technology company providing systems in autonomous systems, cyber, C4ISR, space, strike, and logistics. Industry: Aerospace & Defense

Northrop Grumman currently has 629 open roles on FindRole.

Listed pay typically runs $117,500–$176,300 across 314 roles with salary data.

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At a glance

TL;DR · Manager Programs 2, Advanced Packaging

The Manager Programs 2 - Advanced Packaging joins the Advanced Packaging team within the Northrop Grumman Microelectronics Center. This role focuses on the development, prototyping, maturation, and scaling of next-generation microelectronics packaging technologies for future defense systems. The manager oversees the full program life cycle, including proposal development, startup, execution, and closeout. Key responsibilities involve managing cost, schedule, and technical performance while leading cross-functional Integrated Program Teams. The successful candidate will utilize Earned Value Management, integrated schedules, and Agile methodologies to track performance and manage risks. Core competencies include technical experience in microelectronics fabrication, research, and production, alongside the ability to lead bid and proposal activities, manage supplier relationships, and interface with government and commercial customers to define technical solutions for demanding defense and commercial microelectronics components.

What you'll do

  • Manage the cost, schedule, and technical performance of advanced packaging technology development programs.
  • Lead cross-functional Integrated Program Teams to meet specific program objectives and requirements.
  • Develop new business opportunities through strategic planning, capture planning, and proposal development.
  • Cultivate customer relationships to identify growth opportunities and support value creation strategies.
  • Track and report program performance using Earned Value Management (EVM) or similar cost control methodologies.
  • Manage program resources, including workforce planning and supplier performance.
  • Conduct thorough risk and opportunity management practices to identify and mitigate potential issues.
  • Create and finalize program Statements of Work and establish subordinate baselines.

What we're looking for

  • U.S. Citizenship is required.
  • Active U.S. Government Secret clearance is required.
  • Bachelor’s Degree and 8+ years of relevant experience, Master’s Degree and 6+ years of relevant experience, or PhD and 3+ years of relevant experience.
  • Demonstrated experience leading teams to perform tasks on schedule, at cost, and achieving all requirements as a project lead, integrated program team, or cost account manager.
  • Demonstrated technical experience supporting the research, development, production, and deployment of microelectronics and advanced packaging technologies.
  • Demonstrated verbal and written communication skills through development and delivery of white papers, proposals, technical presentations, customer briefings, and program reviews.
  • Demonstrated experience utilizing Earned Value Management (EVM), integrated schedule, and Agile methodologies to support program execution, cost/schedule performance tracking, and risk management.
  • Master’s or Ph.D. degree in a science or technology field related to microelectronics and semiconductors (preferred).

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