Hardware intern 2027: advanced packaging will join the IBM Research team to explore new advanced soldering techniques. The intern will utilize laser assisted bonding and laser assisted reflow to investigate various solder constellations across different package variations. Daily responsibilities include testing for warpage, solder joint quality, and solder bonding strength over a wide temperature range. The role requires expertise in SMT assembly processes, PCB and laminate design, and stackups. Candidates should possess a background in EE, Physics, or Mechanical Engineering and demonstrate the ability to efficiently define and evaluate experiments. Preferred skills include laser soldering experience, detailed knowledge of soldering alloys, and modeling knowledge for mechanical warpage and in-package stress. This position addresses technical challenges in advanced packaging and hardware reliability.
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