Advanced Packaging Development Engineer

Broadcom

Confirmed live today High trust

Quick summary

Work type: On-site
Location: Irvine, CA
Employment: Full-time
Posted: 137 days ago
Freshness: Confirmed live today
Closes: Nov 22, 2026
Nearby: 99+ roles within 25 mi

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Salary context

How this pay compares to similar roles

Similar $198k

$136k $246k

below market most similar roles pay here above market

This listing doesn't post a salary. Most similar roles pay $161,812–$234,037.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 237 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 160 roles with salary data.

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At a glance

TL;DR · Advanced Packaging Development Engineer

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The Advanced Packaging Development Engineer will join the team to develop and enable advanced packaging technology for AI related products. The primary focus involves integrating memory dies and SoC dies into a single package. Key responsibilities include defining the packaging technology roadmap for future product needs over a three to five year period, supporting the development of key components like HBM, iVR, and Si Cap, and managing reliability tests to qualify new technologies. The role also requires leading yield improvement activities during new technology ramp-ups. Candidates must possess intensive experience in 2.5D/3D and HBM technology development, reliability, and yield improvements. Required skills include project management, teamwork, technology innovation, and development. The work addresses technical challenges in semiconductor integration for AI accelerators and networking chips.

Skills

Advanced Packaging 2.5D 3D HBM Si Cap iVR Yield Improvement Memory Dies

What you'll do

Develop and enable advanced packaging technology to integrate memory and SoC dies.
Create a packaging technology roadmap to meet product needs for the next 3-5 years.
Support the development of key components including HBM, iVR, and Si Cap.
Manage reliability testing to qualify new packaging technologies.
Lead yield improvement activities during new technology ramp-ups.
Drive technology innovation and enablement for AI-related products.

What we're looking for

Master of Science in a related engineering field with at least 10 years of post-degree direct experience is required.
Ph.D. degree in a related engineering field with at least 7 years of post-degree direct experience is required.
Intensive experience in 2.5D/3D and HBM technology development is required.
Experience in reliability and yield improvements for advanced packaging is required.
Project management and teamwork skills are required.
Strength in technology innovation, development, and enablement is a key factor.

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