Technical Project/Program Management Director, Advanced Packaging

Applied Materials

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Quick summary

Work type
On-site
Location
Santa Clara, CA
Salary
$172,000–$237,000 / yr
Employment
Full-time
Posted
145 days ago
Freshness
Confirmed live today

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $212k
This role $204k
$148k $271k
below market most similar roles pay here above market

This role pays more than 50% of similar roles. Most pay $177,250–$246,700 — the blue band above. At the midpoint, this role pays about $204k versus about $212k for comparable roles.

Based on 240 similar postings.

Employer

About Applied Materials

Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment

Applied Materials currently has 337 open roles on FindRole.

Listed pay typically runs $124,000–$171,000 across 219 roles with salary data.

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At a glance

TL;DR · Technical Project/Program Management Director, Advanced Packaging

The Technical Project/Program Management Director - Advanced Packaging serves as a technical program expert providing oversight from conception to implementation for new capability development in advanced packaging technologies, including interconnect scaling initiatives. This role involves managing long-range schedules, task details, and capital allocation requests while ensuring strategies and resources align with program objectives, budgets, and release schedules. The individual will lead multifunctional teams across internal and external stakeholders to execute complex programs, providing technical and operational leadership to achieve milestones. Key responsibilities include resolving cross-functional challenges in process integration and capability readiness. The position requires expertise in advanced packaging systems, engineering and business process knowledge, and proficiency with project management tools like tracking charts and scheduling software to drive system-level innovation and interconnect scaling.

What you'll do

  • Provide technical oversight from conception to implementation for new advanced packaging technologies and interconnect scaling.
  • Align strategies, processes, and resources to meet program objectives, budgets, and release schedules.
  • Define program scope based on customer requirements and internal product technology roadmaps.
  • Manage long-range schedules and task details using project management tools and tracking software.
  • Drive allocated resources from other organizations to achieve on-time and within-budget performance.
  • Initiate and manage capital allocation requests, purchase requisitions, and purchase orders.
  • Lead multifunctional teams across internal and external stakeholders to execute complex programs and achieve milestones.
  • Resolve complex cross-functional challenges in process integration, capability readiness, and system-level performance.

What we're looking for

  • 10+ years of experience.
  • Subject matter expertise in advanced packaging systems, capability development, and integration challenges.
  • Experience leading complex, cross-functional initiatives and providing strategic and operational leadership.
  • Ability to manage long-range schedules and task details using project management tools.
  • Experience managing capital allocation requests, purchase requisitions, and purchase orders.
  • Ability to communicate effectively with senior leadership, partners, customers, and cross-functional stakeholders.
  • Ability to travel up to 50% of the time.
  • Master's Degree.

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