Advanced Packaging Technologist, Mechanical Modeling

What you'll do

• Drive model-based architecture and design decisions for advanced package technologies, materials, and high-layer-count designs.
• Develop and maintain mechanical and multi-physics models for structural, thermo-mechanical, electro-thermal, and electro-optical capabilities.
• Define and execute validation strategies for models by partnering with internal and external laboratories.
• Optimize SMT and mechanical assembly processes, including solder joint reliability, assembly tolerances, and yield.
• Coordinate with PCB suppliers and EMS partners to align material properties and process capabilities with architecture needs.
• Define strategic targets for package technology development and influence product roadmaps for data center platforms.
• Lead failure analysis investigations to translate root-cause findings into design rules or model updates.

What we're looking for

• MS or PhD in relevant Engineering disciplines or physics.
• Demonstrated experience owning model-based architecture and design decisions supported by board, package, and system-level multi-physics modeling (preferred).
• Strong background in advanced PCB technologies, including materials, high-layer-count designs, warpage, and stiffness control (preferred).
• Solid foundation in Mechanics, Fracture, Materials, Design, and FEA with first-principles understanding (preferred).
• Experience influencing SMT processes, connectors, and mechanical assembly strategies from an architecture and modeling perspective (preferred).
• Experience integrating electro-thermal and electro-optical technologies at the board and package level (preferred).
• Proven relevant industry or research experience in modeling-driven system or platform architecture roles (preferred).
• Track record of correlating simulation with physical test data and leading failure analysis investigations (preferred).