Director, Advanced Packaging Disruptive Technology

What you'll do

• Define and execute long-range pathfinding roadmaps for N+2 and beyond advanced packaging technologies.
• Drive concept incubation and feasibility exploration for disruptive packaging approaches and novel interconnect schemes.
• Build and lead a high-impact team focused on exploratory, pre-product technologies and rapid prototyping.
• Translate customer roadmaps and market trends into actionable technology development strategies and new product concepts.
• Establish and manage a collaborative innovation ecosystem with suppliers, foundries, and research institutions.
• Develop executive-level narratives and decision frameworks to communicate technology trade-offs and strategic priorities.
• Establish governance models to transition pathfinding concepts into scalable development pipelines across the organization.

What we're looking for

• 15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.
• Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.
• Strong understanding of current advanced packaging technologies such as D2W, RDL, CoWoS, and TSV.
• Proven experience building and leading cross-functional or exploratory R&D teams.
• Ability to translate complex technology concepts into business impact and strategic direction.
• Advanced degree (PhD/MS) in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related field (preferred).
• Track record of delivering disruptive or first-of-a-kind technology solutions (preferred).
• Experience in heterogeneous integration, chiplet ecosystems, or next-generation packaging architectures (preferred).