Packaging SIPI Engineer, Senior Staff
Qualcomm
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How this pay compares to similar roles
This role pays less than 74% of similar roles. Most pay $167,175–$230,750 — the blue band above. At the midpoint, this role pays about $167k versus about $199k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 558 open roles on FindRole.
Listed pay typically runs $152,130–$222,500 across 534 roles with salary data.
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At a glance
The SIPI Engineer, Sr. joins the Packaging Engineering group to support the Central Hardware System for next-generation server projects. This role focuses on optimizing overall system performance by collaborating with IC, Package, and PBC designers. Key responsibilities include ensuring system-level constraints are met prior to package Tape-out, performing package extraction for time and frequency domain analysis, and conducting system-level analysis for DDR, SerDes, and PDN. The engineer will develop design guidelines for Package and PCB design while creating technical documentation. Required skills include expertise in Electromagnetics, transmission line theory, and crosstalk. Candidates must be proficient in field solvers like HFSS, Q3D, Sentinel-PSI, and Clarity, as well as simulation tools like ADS and Hspice, alongside experience with Cadence Allegro, Mentor Xpedition, and Matlab.
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