Packaging SIPI Engineer, Senior Staff

Qualcomm

Confirmed live today Trusted

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$191,800–$287,800 / yr
Posted
40 days ago
Freshness
Confirmed live today
Closes
Mar 16, 2027

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $207k
This role $240k
$150k $303k
below market most similar roles pay here above market

This role pays more than 76% of similar roles. Most pay $174,712–$239,312 — the blue band above. At the midpoint, this role pays about $240k versus about $207k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 575 open roles on FindRole.

Listed pay typically runs $147,900–$221,900 across 550 roles with salary data.

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At a glance

TL;DR · Packaging SIPI Engineer, Senior Staff

JOB TITLE: Packaging SIPI Engineer, Sr. Staff The Packaging SIPI Engineer, Sr. Staff joins the Package Electrical Team to focus on signal integrity and power integrity. This leadership role involves collaborating with package and IC designers to optimize designs and perform system simulations to ensure all constraints are met before package tape-out. Key responsibilities include performing package extractions for time and frequency domain analysis, providing design guidelines, and developing automated analysis flows. The candidate will work with PHY owners on specs for LPDDR, PCIe, UFS, USB, and MIPI interfaces while assessing ball assignment impacts with PCB designers. Required skills include proficiency in field solvers like HFSS, Q3D, Sentinel-PSI, and Clarity, as well as ADS, Hspice, Matlab, and programming languages like C/C++, Perl, or Python.

What you'll do

  • Perform package extraction for time domain and frequency domain analysis.
  • Conduct system-level analysis for DDR, SerDes, and mixed-signal interfaces.
  • Provide technical design guidelines for package design and optimization.
  • Execute system simulations to ensure all constraints are met prior to tape-out.
  • Develop and automate design and analysis flows.
  • Create technical documentation and presentations for stakeholders.
  • Lead a team of engineers across multiple international geos to deliver auto products.
  • Provide technical guidelines to upper management for key decision-making processes.

What we're looking for

  • Bachelor's degree in Chemical, Electrical, or Mechanical Engineering and 6+ years of System/Package Design/Technology Engineering experience.
  • Master's degree in Chemical, Electrical, or Mechanical Engineering and 5+ years of System/Package Design/Technology Engineering experience.
  • PhD in Chemical, Electrical, or Mechanical Engineering and 4+ years of System/Package Design/Technology Engineering experience.
  • Experience in AUTO package design and analysis (preferred).
  • Experience in SerDes design specifications such as PCIe Gen-x, USB, and UFS in Server design (preferred).
  • Experience in Matlab, C/C++, Perl, or Python (preferred).
  • Master’s degree or Ph.D. with 15+ years of experience (preferred).
  • Prior management experience (preferred).

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