This role pays less than
54%
of similar roles. Most pay
$170,000–$222,000
— the shaded band above.
At the midpoint, this role pays about
$192k
versus about
$196k
for comparable roles.
Based on 240 similar postings.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
623 open roles
on FindRole.
Listed pay typically runs
$148,300–$222,500
across 603 roles with salary data.
Package Design Engineer - Staff works within the Data Center team to develop high-performance, energy-efficient server solutions for data center applications. The role involves owning advanced package selection, product structure configuration, and physical design for SoC packages and modules. Key responsibilities include managing layout optimization, tape-out processes, and coordinating with multi-functional teams to achieve optimal mechanical, electrical, and thermal performance. The candidate will develop design verification strategies, optimize pinouts, and ensure SI/PI requirements are met while exploring new CAD tools. Required technical skills include proficiency in Cadence APD, SiP, or Siemens Xpedition Package Designer, along with experience in DFM, DRC, and ERC. Knowledge of high-speed interfaces like DDR, PCIe, and UCIE is essential, alongside familiarity with advanced configurations such as Flip chip BGA and 2.5D/3D Interposer technologies to solve complex integration challenges.