below marketmost similar roles pay hereabove market
This role pays less than
56%
of similar roles. Most pay
$177,300–$237,912
— the blue band above.
At the midpoint, this role pays about
$200k
versus about
$208k
for comparable roles.
Based on 240 similar postings.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
575 open roles
on FindRole.
Listed pay typically runs
$147,900–$221,900
across 550 roles with salary data.
The Package Design Engineer - Staff joins the Data Center team to develop high-performance, energy-efficient server solutions. This role involves owning advanced package selection, new generation product package structures, and configuration optimization. The engineer will perform physical design, layout, and tape-out for packages and modules, while coordinating with multi-functional groups to optimize mechanical, electrical, and thermal performance. Key responsibilities include defining design verification strategies, optimizing pin out, and managing SI/PI requirements. Candidates must be proficient in Cadence APD & SiP or Siemens Xpedition Package Designer, with experience in Constraint Manager, DRC checking, and DFM verification. Technical expertise is required in high-speed IO interfaces like DDR and PCIe, as well as knowledge of flip chip BGA, 2.5D/3D Interposer, and substrate manufacturing processes.