Packaging SIPI Engineer, Principal Engineer

Qualcomm

Confirmed live 2 days ago High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$201,600–$302,400 / yr
Posted
8 days ago
Freshness
Confirmed live 2 days ago
Closes
Mar 2, 2027

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $178k
This role $252k
$116k most similar roles pay here $322k

This role pays more than 92% of similar roles. Most pay $150,574–$204,437 — the shaded band above. At the midpoint, this role pays about $252k versus about $178k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 623 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.

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View all roles at Qualcomm

At a glance

TL;DR · Packaging SIPI Engineer, Principal Engineer

The Packaging SIPI Engineer, Principal Engineer works within a collaborative engineering environment to perform signal and power integrity tasks while partnering with package, platform, and IC designers to optimize system designs. The role involves performing electrical model extraction, conducting signal and power integrity simulations, and providing clear reporting of results for high-speed SerDes projects in the computing and server space. Day-to-day responsibilities include IO analysis for various serial interfaces, analyzing power distribution for reference systems, and providing package design guidelines through time- and frequency-domain analysis. The candidate will utilize field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity, alongside SPICE transient simulation tools like ADS and HSPICE using IBIS and IBIS-AMI models. Technical expertise includes electromagnetics, transmission line theory, MATLAB for automation, and programming in C/C++, Perl, or Python.

What you'll do

  • Perform signal and power integrity simulations for package and system designs.
  • Execute electrical model extraction for high-speed SerDes components.
  • Conduct IO analysis using established methodologies for various serial interfaces.
  • Analyze power distribution for product development and reference systems.
  • Perform package extraction for time- and frequency-domain analysis.
  • Provide technical design guidelines based on simulation results.
  • Document all technical findings and results clearly and thoroughly.

What we're looking for

  • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field with 8+ years of experience.
  • Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field with 7+ years of experience.
  • PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field with 6+ years of experience.
  • 10+ years of experience with high-speed SerDes package, PCB, or system design for computing/server standards.
  • Strong background in electromagnetics, transmission line theory, and crosstalk.
  • Proficiency with field solvers (HFSS, Q3D, Sentinel-PSI, Clarity) and SPICE transient simulation tools (ADS, HSPICE).
  • Experience with SerDes specifications such as PCIe, USB, UFS, and MIPI.
  • Ability to use MATLAB for automation and knowledge of C/C++, Perl, or Python.

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