Senior Staff Packaging SIPI Engineer
Qualcomm
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How this pay compares to similar roles
This role pays more than 92% of similar roles. Most pay $150,574–$204,437 — the shaded band above. At the midpoint, this role pays about $252k versus about $178k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 623 open roles on FindRole.
Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.
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At a glance
The Packaging SIPI Engineer, Principal Engineer works within a collaborative engineering environment to perform signal and power integrity tasks while partnering with package, platform, and IC designers to optimize system designs. The role involves performing electrical model extraction, conducting signal and power integrity simulations, and providing clear reporting of results for high-speed SerDes projects in the computing and server space. Day-to-day responsibilities include IO analysis for various serial interfaces, analyzing power distribution for reference systems, and providing package design guidelines through time- and frequency-domain analysis. The candidate will utilize field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity, alongside SPICE transient simulation tools like ADS and HSPICE using IBIS and IBIS-AMI models. Technical expertise includes electromagnetics, transmission line theory, MATLAB for automation, and programming in C/C++, Perl, or Python.
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