Principal Engineer, Signal and Power Integrity

Qualcomm

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$201,600–$302,400 / yr
Posted
22 days ago
Freshness
Confirmed live yesterday
Closes
Feb 16, 2027

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $183k
This role $252k
$110k most similar roles pay here $323k

This role pays more than 91% of similar roles. Most pay $156,900–$208,800 — the shaded band above. At the midpoint, this role pays about $252k versus about $183k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 623 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.

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View all roles at Qualcomm

At a glance

TL;DR · Principal Engineer, Signal and Power Integrity

As a Principal Engineer, Signal and Power Integrity within the Packaging Engineering group, you will drive advanced package technology development and multi-physics simulation analysis to optimize mechanical, electrical, and thermal performance for various end market applications. You will perform critical signal and power integrity tasks, including electrical model extraction, time and frequency domain analysis, and IO power distribution analysis for high-speed memory interfaces like DDR and LPDDR. The role requires collaborating with multi-disciplinary teams to provide design guidelines and documentation while solving complex package-to-system challenges. Essential skills include expertise in electromagnetics, transmission line theory, and crosstalk. You will utilize tools such as HFSS, Q3D, Sentinel-PSI, Clarity, ADS, Hspice, and Matlab for automation, alongside programming languages like C/C++, Perl, or Python to ensure high performance and reliability across various product designs.

What does a Engineer earn in California?

Median $208000 from 94 postings across 22 companies.

See salary data

What you'll do

  • Drive new advanced package technology development and concept design architecture analysis from package to system.
  • Perform multi-physics simulation analysis and lab validation to optimize mechanical, electrical, and thermal performance.
  • Conduct signal and power integrity simulations for high-speed memory interfaces.
  • Execute electrical model extraction for time domain and frequency domain analysis.
  • Analyze IO power distribution in product development and reference systems using established methodologies.
  • Provide design guidelines for package structures based on extracted data and simulation results.
  • Create clear and complete documentation of technical results for internal and external stakeholders.

What we're looking for

  • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field with 8+ years of experience.
  • Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field with 7+ years of experience.
  • PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field with 6+ years of experience.
  • Experience in electromagnetics and a solid background in transmission line theory and crosstalk (preferred).
  • Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity, and SPICE transient simulation including IBIS models (preferred).
  • Experience in DDR design specifications such as DDR and LPDDR (preferred).
  • Experience in Matlab to automate existing simulation flow (preferred).
  • Experience in programming languages like C/C++ or scripting languages like Perl/Python (preferred).

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