Product Planning Engineer, ASIC/SoC

Amd

Confirmed live today High trust

Quick summary

Work type
On-site
Location
San Jose, CA
Salary
$160,000–$240,000 / yr
Posted
152 days ago
Freshness
Confirmed live today
Closes
May 12, 2027

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $203k
This role $200k
$137k $273k
below market most similar roles pay here above market

This role pays less than 58% of similar roles. Most pay $177,250–$227,900 — the blue band above. At the midpoint, this role pays about $200k versus about $203k for comparable roles.

Based on 240 similar postings.

Employer

About Amd

AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors

Amd currently has 510 open roles on FindRole.

Listed pay typically runs $172,000–$258,000 across 510 roles with salary data.

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At a glance

TL;DR · Product Planning Engineer, ASIC/SoC

The Product Planning Engineer-ASIC/SoC is responsible for the product planning of next-generation AMD Adaptive and Embedded Computing products, specifically focusing on ASIC, SoC, FPGA, Adaptive SoC, and semi-custom products. The role involves driving product strategy, roadmap planning, and requirements by translating customer needs, market opportunities, and business objectives into actionable product definitions. Key responsibilities include managing requirements for power efficiency, thermal performance, packaging, quality, reliability, manufacturability, and performance per watt. The successful candidate will collaborate with architecture, design, product engineering, validation, manufacturing, and marketing teams to influence technical direction through data-driven analysis and competitive assessment. This position requires a deep understanding of semiconductor product tradeoffs, system architecture, and product development to navigate complex technical constraints and identify product-level risks and opportunities.

What you'll do

  • Drive product planning for future ASIC, SoC, FPGA, Adaptive SoC, and semi-custom products.
  • Translate customer, market, and business requirements into actionable product definitions and roadmap recommendations.
  • Define product requirements for power efficiency, thermal performance, packaging, quality, reliability, and manufacturability.
  • Identify product-level risks and opportunities regarding power delivery, thermal solutions, and manufacturing constraints.
  • Influence technical direction through requirements development, competitive analysis, and data-driven product planning.
  • Partner with engineering teams to challenge assumptions and evaluate alternatives to improve product competitiveness.
  • Serve as a technical and business point of contact across architecture, manufacturing, marketing, and customer-facing teams.

What we're looking for

  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
  • 10+ years of relevant experience in semiconductor product development, system architecture, product planning, product management, technical marketing, applications engineering, product engineering, or related technical roles (preferred).
  • Demonstrated experience influencing product, architecture, or engineering decisions through requirements development, technical analysis, customer engagement, or product planning (preferred).
  • Strong understanding of semiconductor product tradeoffs involving performance, power, thermal management, packaging technologies, quality, reliability, manufacturability, cost, and time-to-market (preferred).
  • Experience defining product requirements, platform requirements, roadmap strategies, product planning inputs, or product investment recommendations (preferred).
  • Experience working with FPGA, Adaptive SoC, ASIC, CPU, GPU, AI accelerator, networking, communications, embedded, or semi-custom semiconductor products (preferred).
  • Experience working across architecture, engineering, product engineering, validation, manufacturing, packaging, and quality organizations (preferred).
  • Ability to translate customer needs, market trends, and technical constraints into structured product requirements.

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