Package Design Engineer

What you'll do

• Lead the overall design of ASIC packages, focusing on signal integrity, power integrity, manufacturability, reliability, and thermal performance.
• Design critical package structures for high-speed components including SerDes, ADC/DAC, DDR, and HBM.
• Perform physical design and layout for flip-chip BGA packages.
• Manage project schedules, priorities, and customer interfaces for multiple simultaneous design projects.
• Develop and implement process improvements, automation, and documentation to increase design team efficiency.
• Coordinate with internal teams and external vendor designers across multiple time zones.

What we're looking for

• BSEE or similar field degree and 2+ years of experience in flip-chip-BGA package design.
• MSEE or PhD degree and knowledge of electrical engineering fundamentals.
• Experience with high-speed SerDes or 5G RF/Microwave ADC/DAC, HBM, and DDR5.
• Ability to perform physical design layout and manage signal, power, thermal, and reliability aspects.
• Ability to schedule, prioritize, and track work across 2+ projects simultaneously.
• Working knowledge of package-level signal integrity and power integrity (preferred).
• Experience with Cadence APD (Allegro Package Designer) or an equivalent layout tool (preferred).
• 1 or more years of experience with Cadence SKILL for Allegro or similar design-automation coding (preferred).