Packaging Design Engineer
Amd
Quick summary
Market check
How this pay compares to similar roles
This role pays more than 89% of similar roles. Most pay $147,500–$214,250 — the blue band above. At the midpoint, this role pays about $250k versus about $181k for comparable roles.
Based on 240 similar postings.
Employer
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has 496 open roles on FindRole.
Listed pay typically runs $172,000–$258,000 across 496 roles with salary data.
Most-posted roles
At a glance
The Electrical Packaging Design Engineer joins the AECG - Embedded Team to build and optimize platforms for embedded and commercial applications. This role involves defining cost-effective, high-performance solutions for multiple FPGA device package families by translating electrical requirements into manufacturable package technology. Key responsibilities include using Cadence tools for design, modeling, and simulations, conducting routing and stack-up studies, and performing Power Integrity analysis for core and IO. The engineer will develop multi-signal package models over 50 GHz bandwidth, collaborate with PCB Layout Engineers on ballmaps, and create scripts to maintain electrical design guidelines. Required skills include proficiency in Cadence package design tools, 2D/3D modeling software like Ansys or AutoCAD, and knowledge of Organic/PCB technologies, SerDes design, and DFM/DFR principles.
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What you'll do
What we're looking for
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