This role pays more than
92%
of similar roles. Most pay
$146,000–$197,500
— the shaded band above.
At the midpoint, this role pays about
$250k
versus about
$172k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
367 open roles
on FindRole.
Listed pay typically runs
$166,400–$249,600
across 367 roles with salary data.
The Packaging Design Engineer joins the AECG - Embedded Team to develop and optimize platforms for embedded and commercial applications across silicon, firmware, and software. Working within the Package group, this individual will manage multiple package families for FPGA devices by translating electrical requirements into cost-effective, manufacturable package technologies. Daily responsibilities include using Cadence tools for design, modeling, and simulations; performing Power Integrity analysis; conducting routing, stack-up, and component placement studies; and developing multi-signal models over 50 GHz bandwidth. The role requires proficiency in Cadence, Ansys, AutoCAD, and SKILL, along with knowledge of SerDes design, DFM/DFR, and organic technologies. This position solves critical hardware challenges by defining package requirements during project conception and collaborating with PCB Layout Engineers to optimize ballmaps and die sizes for high-performance, high-speed chips and systems.
Cadence APD
PCB Layout
HDI Design
Virtuoso
Calibre
Valor
Constraint Manager
Signal Integrity
IC Substrates
Wire Bond
Flip Chip
Package Routing
Power Distribution
CAD Library Databases
High-Speed Design
Remote (Santa Clara, CA)+146 days ago
$136,000–$218,500
Python
C++
AI
LLMs
Signal Integrity
Power Delivery
Parasitic Extraction
IC Physical Design
Data Structures
Algorithms
Object-Oriented Design
Package Design Flow