Package Design Engineer

Broadcom

Confirmed live today Trusted

Quick summary

Work type
On-site
Location
San Jose, CAAustin, TXFort Collins, CO
Employment
Full-time
Posted
148 days ago
Freshness
Confirmed live today
Closes
Nov 26, 2026
Nearby
99+ roles within 25 mi

Market check

Salary context

How this pay compares to similar roles

Similar $191k
$134k $239k
below market most similar roles pay here above market

This listing doesn't post a salary. Most similar roles pay $165,825–$216,587.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 280 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 169 roles with salary data.

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At a glance

TL;DR · Package Design Engineer

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As a Package Design Engineer, you will join a worldwide R&D team to develop high-performance package designs for ASICs used in artificial intelligence, networking, high-performance computing, and 5G base stations. You will hold overall design responsibility for complex flip-chip-BGA packages, focusing on critical structures for SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, and DDR5. Your daily work involves physical design layout, managing signal integrity, power integrity, manufacturability, reliability, and thermal requirements across multiple projects. You will utilize Cadence APD or equivalent tools, potentially employing Cadence SKILL for design-automation coding. The role requires collaborating with internal and external designers to create package structures that enable new designs while contributing to process improvements, automation, and documentation for the broader design team.

Skills

IC Package Design Flip-chip BGA SerDes Signal Integrity Power Integrity ASIC HBM DDR5 RF Microwave Cadence APD Allegro Package Designer Cadence SKILL Physical Design Layout Automation Manufacturability

What you'll do

  • Lead the overall design of ASIC packages, focusing on signal integrity, power integrity, manufacturability, reliability, and thermal performance.
  • Design critical package structures for high-speed components including SerDes, ADC/DAC, DDR, and HBM.
  • Perform physical design and layout as a foundational responsibility for flip-chip BGA packages.
  • Manage project schedules, prioritize tasks, and track progress across multiple simultaneous projects.
  • Serve as the primary project manager and customer interface for assigned design projects.
  • Develop and implement process improvements, automation, and documentation to increase design team efficiency.
  • Coordinate with internal teams and external vendor designers across multiple time zones.

What we're looking for

  • BSEE or similar field degree and 12+ years of experience in flip-chip-BGA package design.
  • MSEE or similar field degree and 10+ years of work experience.
  • Experience in flip-chip-BGA package design for high-speed SerDes.
  • Knowledge of package-level signal integrity and power integrity.
  • Experience with Cadence APD (Allegro Package Designer) or an equivalent tool (preferred).
  • Experience with Cadence SKILL for Allegro or similar design-automation coding (preferred).
  • Ability to work on-site at the Broadcom office 5 days a week.
  • Self-management and organization skills.

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