Principal Subsystem Design Engineer
Microsoft
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How this pay compares to similar roles
This role pays less than 81% of similar roles. Most pay $217,200–$285,575 — the shaded band above. At the midpoint, this role pays about $209k versus about $251k for comparable roles.
Based on 240 similar postings.
Employer
Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing
Microsoft currently has 598 open roles on FindRole.
Listed pay typically runs $119,800–$234,700 across 586 roles with salary data.
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At a glance
The Director, Silicon Design joins the Artificial Intelligence System on Chip team within the Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering group. This leadership role involves managing a Subsystem design team, mentoring engineers, and providing technical leadership for complex projects. The successful candidate will deliver custom Intellectual Property and System on Chip designs while collaborating with architects to develop micro-architectural specifications and working with verification engineers to execute them. Key responsibilities include overseeing RTL coding, synthesis, timing constraints, and power, performance, and area trade-offs. Required skills include expertise in PCIe, DDR, or HBM, as well as experience with CPUs, GPUs, and Tensor units. The role utilizes Agile methodologies and may involve scripting languages like Python or Perl to solve technical challenges related to high-performance cloud infrastructure and AI/ML hardware.
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