Principal Silicon Architect

Microsoft

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Mountain View, CARedmond, WAAustin, TXHillsboro, ORRaleigh, NC
Salary
$142,800–$274,800 / yr
Posted
9 days ago
Freshness
Confirmed live yesterday
Closes
Mar 1, 2027

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $230k
This role $209k
$126k most similar roles pay here $296k

This role pays less than 65% of similar roles. Most pay $203,150–$256,387 — the shaded band above. At the midpoint, this role pays about $209k versus about $230k for comparable roles.

Based on 240 similar postings.

Employer

About Microsoft

Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing

Microsoft currently has 598 open roles on FindRole.

Listed pay typically runs $119,800–$234,700 across 586 roles with salary data.

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At a glance

TL;DR · Principal Silicon Architect

As a Principal Silicon Architect, you will provide technical leadership throughout all phases of ASIC and SoC development with a primary focus on early architecture definition and specification of Network-on-Chip, memory, and interconnect subsystems for high-performance AI and compute SoCs. You will define system-level address maps, memory hierarchy, and SoC connectivity while translating performance objectives into scalable data movement architectures. Your daily work involves evaluating third-party IP, silicon technologies, and vendor solutions while balancing power, area, and risk. You will collaborate with modeling, firmware, and software teams to ensure architectural alignment and resolve complex design tradeoffs. The role requires expertise in on-chip interconnects, memory hierarchy, security, die-to-die interconnect, debug, telemetry, boot/reset, and RAS. You must possess extensive experience in large-scale SoC design to solve critical technical challenges in high-performance computing environments.

What you'll do

  • Define early architecture and specifications for Network-on-Chip (NoC) and memory/interconnect subsystems.
  • Establish system-level address maps, memory hierarchies, and SoC connectivity.
  • Translate product performance goals into scalable data movement architectures.
  • Evaluate and recommend third-party IP, silicon technologies, and vendor solutions based on PPA constraints.
  • Partner with modeling teams to define requirements and identify system bottlenecks early in the design cycle.
  • Guide design and verification teams to ensure implementation fidelity to architectural intent.
  • Support pre-silicon validation, post-silicon bring-up, and performance characterization activities.
  • Resolve complex architectural issues and lead critical design trade-offs for system-level decisions.

What we're looking for

  • Must have a Doctorate with 3+ years experience, a Master's with 6+ years experience, or a Bachelor's with 8+ years experience in engineering/science fields.
  • Must have at least 10 years of architecture and design experience in large-scale SoCs.
  • Must possess expertise in on-chip interconnect and memory hierarchy systems.
  • Must have a track record of successfully designing IPs and SoCs.
  • Experience with security, die-to-die interconnect, debug, telemetry, boot/reset, and RAS is required.
  • Ability to define system-level address maps, memory hierarchy, and SoC connectivity for high-performance AI and compute SoCs.
  • Ability to translate performance objectives into scalable NoC, memory, and data movement architectures.
  • Must be able to meet export control requirements including ITAR, EAR, or EU Dual Use Regulations.

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