Staff Board Design Engineer

Qualcomm

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $134,800–$202,200 / yr
Posted: 24 days ago
Freshness: Confirmed live yesterday
Closes: Feb 14, 2027
Nearby: 99+ roles within 25 mi

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $210k

This role $168k

$121k most similar roles pay here $267k

This role pays less than 81% of similar roles. Most pay $175,000–$245,000 — the shaded band above. At the midpoint, this role pays about $168k versus about $210k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 623 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.

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View all roles at Qualcomm

At a glance

TL;DR · Staff Board Design Engineer

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Board Design Engineer, Staff joins the Central Hardware Systems Board design & layout team to develop high-quality printed circuit board layouts for advanced IoT and Compute reference platforms. The role involves designing multi-layer stack-ups for application processors, digital processors, RF/radio circuits, and power delivery networks while implementing complex constraints into form factor accurate designs. You will utilize Siemens/Mentor Xpedition, Altium, or Cadence Allegro tools to manage high-speed, high-density electronics packaging including stacked micro-vias and sequential lamination. Key technical requirements include experience with DDR5, HDMI, PCIe, SATA, MIPI, and USB interfaces, alongside proficiency in Valor or CAM350 for DFM analysis. You will collaborate with global partners and internal teams to resolve fabrication issues, manage EMI mitigation techniques, and ensure all designs meet manufacturing standards for high-volume circuit boards and consumer-grade products.

Skills

PCB Design Siemens/Mentor Xpedition Altium Cadence Allegro high speed design HDI DFM Valor CAM350 RF Analog Digital Circuits DDR5 LPDDR HDMI PCIe SATA MIPI USB GigE PLM Agile MS Office 365

What you'll do

Design and document multi-layer PCB layouts for high-volume IoT and compute reference platforms.
Engineer complex stack-ups for application processors, digital processors, RF circuits, and power delivery networks.
Implement advanced manufacturing techniques including stacked micro-vias and small-pitch package design rules.
Perform DFM analysis using tools like Valor or CAM350 to ensure manufacturability of high-density electronics.
Resolve technical issues with fabrication and assembly vendors throughout the product lifecycle.
Propose and implement PCB design trade-offs to meet performance, cost, and schedule objectives.
Apply EMI mitigation techniques and standards for high-speed digital circuits like DDR5, PCIe, and USB.
Deliver design reviews and communicate project milestones to internal teams and external partners.

What we're looking for

Bachelor's degree in Engineering or related field with 4+ years of experience (or Master's with 3+ years, or PhD with 2+ years).
Experience as a Board design Engineer in the IOT industry.
6+ years of experience in high-speed PCB design and HDI/high-density electronics packaging.
4+ years of experience designing consumer-grade products using latest generation processor chips and ICs.
Proficiency in Siemens/Mentor Xpedition, Altium, or Cadence Allegro PCB design software.
Experience with RF, Analog, and high-speed digital circuits including DDR5, HDMI, PCIe, SATA, MIPI, USB, and GigE.
Experience with DFM analysis using Valor or CAM350 tools.
Proficiency in MS Office 365 tools and understanding of how to use AI to solve problems.