Senior Staff Board Engineer

Qualcomm

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $162,600–$244,000 / yr
Posted: 3 days ago
Freshness: Confirmed live yesterday
Closes: Mar 7, 2027
Nearby: 99+ roles within 25 mi

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $184k

This role $203k

$131k most similar roles pay here $256k

This role pays more than 65% of similar roles. Most pay $144,500–$223,961 — the shaded band above. At the midpoint, this role pays about $203k versus about $184k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 623 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.

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View all roles at Qualcomm

At a glance

TL;DR · Senior Staff Board Engineer

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Board Engineer, Senior Staff joins the Central Hardware Systems Board design and layout team to develop high-quality PCB layouts for advanced breakout designs across Data Center, Server, and Compute reference platforms. This role involves designing multi-layer stack-ups for application processors, digital processors, RF circuits, and power delivery networks while utilizing advanced manufacturing techniques like stacked micro-vias and small-pitch package rules. The engineer will collaborate with internal teams and global partners to implement schematics into high-volume circuit boards and manage the fabrication lifecycle. Key technical requirements include proficiency in Siemens/Mentor Xpedition, Altium, or Cadence Allegro tools, along with experience in DFM analysis using Valor or CAM350. The role addresses complex hardware challenges involving high-speed digital circuits, EMI mitigation, and various interfaces such as DDR5, PCIe, and HDMI for 6G R&D systems.

Skills

PCB Design Xpedition Allegro Altium high speed design HDI DFM Valor CAM350 RF Analog DDR5 HDMI PCIe SATA MIPI USB GigE LPDDR EMI Mitigation PLM MS Office 365

What you'll do

Design and document printed circuit board layouts for high-volume products and R&D systems.
Engineer multi-layer stack-ups for application processors, digital processors, RF circuits, and power delivery networks.
Implement advanced manufacturing techniques including stacked micro-vias and small-pitch package design rules.
Perform DFM analysis using tools like Valor or CAM350 to ensure manufacturability.
Resolve complex PCB design issues with fabrication and assembly vendors throughout the product lifecycle.
Propose technical trade-offs to resolve design challenges while meeting cost and schedule objectives.
Implement EMI mitigation techniques for high-speed digital and RF circuits.
Deliver design reviews and communicate project milestones to internal teams and external partners.

What we're looking for

Bachelor's degree in Electrical/Electronics Engineering or related field with 6+ years of experience (or Master's with 5+, or PhD with 4+).
12+ years of experience in high-speed PCB design and HDI/high-density electronics packaging.
10+ years of experience designing consumer-grade or low-volume test products using latest generation chips and ICs.
Proficiency in Siemens/Mentor Xpedition, Altium, or Cadence Allegro PCB design tools.
Experience performing DFM analysis using Valor and/or CAM350 tools.
Familiarity with COTS IOT interfaces and proficiency in MS Office 365.
Understanding of how to use AI to solve problems.
Knowledge of RF, Analog, and high-speed digital circuits like DDR5, PCIe, and USB (preferred).