Senior PCB Designer

Qualcomm

Confirmed live 2 days ago Trusted

Quick summary

Work type
On-site
Location
San Diego, CA
Posted
51 days ago
Freshness
Confirmed live 2 days ago
Closes
Jan 18, 2027

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Salary context

How this pay compares to similar roles

Similar $191k
$137k most similar roles pay here $227k

This listing doesn't post a salary. Most similar roles pay $166,300–$216,250.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 623 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.

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At a glance

TL;DR · Senior PCB Designer

As a PCB Designer, Senior on the Central Hardware Systems team, you will design high-density printed circuit board layouts for strategic platforms including Mobile, Automotive, Infrastructure, IoT, and Compute. You will manage the full lifecycle from concept to fabrication, creating designs that accommodate micro-vias, sequential lamination stack-ups, and 0.5mm pitch packages. Your daily work involves developing solutions for 5G designs, managing trade-offs for cost and performance, and coordinating with manufacturing vendors to resolve assembly issues. You will utilize tools such as Siemens/Mentor Xpedition, PADS, Altium, or Cadence Allegro, while applying expertise in RF, analog, and high-speed digital circuits like DDR, HDMI, PCIe, and USB. The role focuses on solving complex hardware challenges for high-performance electronic assemblies and ensuring designs meet rigorous manufacturing standards and technical requirements across diverse product lines.

What you'll do

  • Design high-density PCB layouts for 5G products across mobile, automotive, and infrastructure sectors.
  • Develop circuit boards featuring micro-vias, sequential lamination stack-ups, and components with 0.5mm pitch or smaller.
  • Implement designs for RF, radio circuits, power control devices, and high-speed digital interfaces like PCIe and DDR.
  • Resolve technical design issues with fabrication and assembly vendors to ensure manufacturability.
  • Present PCB design trade-offs and solutions to engineering teams to meet performance and cost goals.
  • Conduct DFM analysis using tools like Valor or CAM350 to optimize production quality.
  • Lead project tasks by providing direction, prioritization, and clear communication to team members and stakeholders.

What we're looking for

  • Associate’s degree in Electronics, Electrical Technology, or a related technical field.
  • 3+ years of active experience in PCB design for high-density electronics packaging.
  • 3+ years of experience designing consumer-grade mobile products or low-volume test products using latest-generation processor chips and ICs.
  • Proficiency in Siemens/Mentor Xpedition, PADS, Altium, or Cadence Allegro PCB design software.
  • Experience with RF, Analog, and high-speed digital circuit design including DDR, HDMI, PCIe, SATA, MIPI, USB, and GigE.
  • Expert understanding of PCB design principles, fabrication and assembly process capabilities, and EMI mitigation techniques.
  • Experience with DFM analysis using Valor or CAM350 tools.
  • Strong verbal and written communication skills to deliver status reports and lead project milestones.

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