Senior PWB Designer

Qualcomm

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: San Diego, CA
Posted: 30 days ago
Freshness: Confirmed live yesterday
Closes: Feb 8, 2027
Nearby: 99+ roles within 25 mi

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Salary context

How this pay compares to similar roles

Similar $183k

$137k most similar roles pay here $227k

This listing doesn't post a salary. Most similar roles pay $157,007–$208,800.

Based on 240 similar postings.

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About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 623 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.

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At a glance

TL;DR · Senior PWB Designer

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PWB Designer, Senior joins the Central Hardware Systems PCB CAD team to design high-density printed circuit boards for strategic platforms including Mobile, Automotive, Infrastructure, IoT, and Compute. This role involves developing complex layouts from concept through fabrication while managing technical trade-offs for cost-effective production. You will work with micro-vias, sequential lamination stack-ups, and 0.5mm pitch packages to support 5G designs, RF circuits, and power control devices. Key responsibilities include collaborating with global teams, performing DFM analysis, and resolving fabrication issues with vendors. Required expertise includes proficiency in Siemens/Mentor Xpedition, PADS, Altium, or Cadence Allegro tools. The role demands experience with high-speed digital designs like DDR, HDMI, PCIe, and USB, alongside EMI mitigation techniques. You will solve complex hardware challenges by ensuring all boards meet rigorous manufacturing standards and specific project requirements for various electronic assemblies.

Skills

PCB Design Siemens/Mentor Xpedition PADS Altium Cadence Allegro RF High-Speed Digital HDMI PCIe SATA MIPI GigE EMI Mitigation DFM Valor CAM350

What you'll do

Design high-density PCB layouts for 5G products across mobile, automotive, and infrastructure platforms.
Develop circuit boards featuring micro-vias, sequential lamination stack-ups, and components with 0.5mm pitch or smaller.
Implement complex designs involving RF, radio circuits, power control devices, and high-speed digital interfaces like PCIe and DDR.
Resolve technical design issues by coordinating with fabrication and assembly vendors to ensure manufacturability.
Present PCB design trade-offs and solutions to engineering teams to balance quality, cost, and schedule.
Conduct DFM analysis using tools like Valor or CAM350 to ensure designs meet manufacturing standards.
Lead project tasks by providing direction and prioritization to team members and stakeholders.
Contribute to internal process improvements, including the development of DFM checklists and design guidelines.

What we're looking for

Associate’s degree in Electronics, Electrical Technology, or a related technical field.
Bachelor’s degree in electrical engineering, electronics engineering technology, or a related technical field (preferred).
3+ years of active experience in PCB design for high-density electronics packaging.
3+ years of experience designing consumer-grade mobile products or low-volume test products using latest-generation processor chips and ICs.
Proficiency in Siemens/Mentor Xpedition, PADS, Altium, or Cadence Allegro PCB design software.
Experience with RF, Analog, and high-speed digital circuit design (preferred).
Expertise in EMI mitigation techniques and DFM analysis using Valor or CAM350 tools (preferred).
Strong verbal and written communication skills to deliver status reports and lead project milestones (preferred).