Staff PCB Designer

What you'll do

• Design high-quality PCB layouts for server, 6G, and compute platforms using Siemens/Mentor Xpedition or Cadence Allegro.
• Engineer multi-layer stack-ups for application processors, digital processors, RF circuits, and power delivery networks.
• Implement advanced manufacturing techniques including stacked micro-vias, sequential lamination, and small-pitch package design rules.
• Perform Design for Manufacture (DFM) analysis using Valor or CAM350 tools to ensure production feasibility.
• Resolve complex PCB design issues with fabrication and assembly vendors throughout the product lifecycle.
• Develop technical solutions and trade-offs to meet high-speed signal requirements and cost-effective manufacturing goals.
• Implement EMI mitigation techniques for high-speed digital circuits including DDR5, PCIe, and USB.
• Provide input on process improvements, DFM checklists, and internal design guidelines.

What we're looking for

• Must have 5+ years of experience in high-speed PCB design.
• Must have 5+ years of experience in HDI and high-density electronics packaging.
• Must have 2+ years of experience designing consumer or low-volume test products with latest generation processors and ICs.
• Must have experience performing DFM analysis using Valor and/or CAM350 tools.
• Must be proficient in Siemens/Mentor Xpedition or Cadence Allegro PCB design software.
• Must possess expert knowledge of PCB design principles, fabrication capabilities, and assembly limitations.
• Experience with EMI mitigation techniques and IDF/EMN file exchange is preferred.
• Must have strong communication skills to collaborate with internal teams and external vendors.