Principal IC Packaging Engineer

Qualcomm

Actively hiring
San Diego, Ca,Us, US Posted 139 days ago $201,600–$302,400 / year
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At a glance

AI generated

TL;DR

The Principal IC Packaging Engineer at Qualcomm Technologies will lead the development of cutting-edge integrated circuit packaging technologies for Data Center AI and Power Management products. This senior role involves driving innovation from concept to high-volume manufacturing, focusing on advanced methods like Redistribution Layer (RDL) packages, wafer bonding, flip chip, wire bond, and System in Package (SiP). The engineer will manage multi-disciplinary teams, collaborate with multiple Outsourced Semiconductor Assembly and Test providers, and resolve complex technical challenges. Essential skills include expertise in package architecture, high-density interconnect design, materials science, and equipment knowledge. Ideal candidates have extensive experience in 2.5D/3D packaging for high-performance computing products and a deep understanding of semiconductor industry trends.

Skills

RDL Wafer Bonding Flip Chip Wire Bond SiP Materials Science Equipment Expertise High-Density Interconnect Design Reliability Standards Test Methods Qualification Procedures Failure Analysis Techniques Substrate Manufacturing Processes Design Rules Technical Project Management Cross-Functional Team Leadership

What you'll do

  • Lead the development and innovation of advanced IC packaging technologies.
  • Oversee new product introductions to ensure smooth transition to high-volume manufacturing.
  • Apply expertise in package architecture and design rules for performance and reliability.
  • Manage relationships with multiple foundries and OSATs for full-scale production.
  • Resolve complex technical issues throughout the development and manufacturing process.

What we're looking for

  • Extensive hands-on experience in advanced packaging technologies like RDL, wafer bonding, and 3D packaging.
  • Expertise in managing high-volume manufacturing transitions for complex package designs.
  • Comprehensive knowledge of semiconductor industry trends and end-user requirements.
  • Ability to lead multi-disciplinary teams and manage relationships with multiple OSAT providers.
  • Strong background in reliability standards, test methods, qualification procedures, and failure analysis.
  • Demonstrated capability to resolve complex technical issues during development and manufacturing.

Market check

Salary context

This $201,600–$302,400 range sits above 92% of similar postings on FindRole.

Peer median band

$140,650–$221,800

Median floor and ceiling across peers.

Typical midpoint (25–75%)

$152,875–$216,250

Middle half of comparable postings.

Based on 240 comparable postings.

* 240 is the maximum number of comparable postings sampled.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 569 open roles on FindRole.

Listed pay typically runs $148,300–$224,400 across 536 roles with salary data.

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View all roles at Qualcomm

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