This role pays more than
88%
of similar roles. Most pay
$168,200–$226,562
— the shaded band above.
At the midpoint, this role pays about
$252k
versus about
$197k
for comparable roles.
Based on 240 similar postings.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
623 open roles
on FindRole.
Listed pay typically runs
$148,300–$222,500
across 603 roles with salary data.
The Principal IC Packaging Engineer joins the Packaging Engineering team to lead the development of advanced integrated circuit packaging technologies. This role focuses on spearheading new product introductions for Data Center AI and Power Management markets, driving innovation from initial concept through high-volume manufacturing at assembly suppliers. The engineer will manage multi-disciplinary teams and coordinate with multiple OSAT providers to resolve complex technical challenges. Key responsibilities include overseeing wafer bonding, RDL, 3D, wafer dicing, and 2.5D packaging while ensuring adherence to design rules and reliability standards. Required expertise includes high-density interconnect package design, fan-out bridges, FCBGA, MCM, and wire bond processes. The candidate must possess deep knowledge of materials, equipment, and substrate manufacturing processes to solve technical problems related to high-performance computing products and advanced die-to-die interconnects in a production environment.