Next-Gen High-Speed Memory Subsystem ASIC Digital Design Engineer
Qualcomm
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How this pay compares to similar roles
This role pays less than 88% of similar roles. Most pay $176,450–$227,500 — the blue band above. At the midpoint, this role pays about $152k versus about $202k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 589 open roles on FindRole.
Listed pay typically runs $147,900–$221,900 across 563 roles with salary data.
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At a glance
Next-Gen System Cache ASIC Digital Design Engineer joins the ASICS Engineering team to develop SOC Interconnects, Cache, and Memory Controllers for Snapdragon platforms. This role involves micro-architecting, designing, and validating RTL for blocks and modules within memory subsystems and power systems. You will evaluate hardware feasibility for complex algorithms, develop specifications for new generation designs, and perform essential verification and debugging throughout the project cycle. Key responsibilities include optimizing hardware for performance, power, and cost while troubleshooting silicon issues. The position requires proficiency in Verilog, SystemVerilog, Synopsys synthesis, and low power design. Candidates should possess skills in Computer Architecture, Computer Arithmetic, and programming in C/C++ or Python. The work focuses on solving hardware design challenges for smartphones, PCs, Chromebooks, virtual reality, and automotive solutions.
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