Next-Gen System Cache ASIC Digital Design Engineer
Qualcomm
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How this pay compares to similar roles
This role pays less than 58% of similar roles. Most pay $167,137–$223,000 — the blue band above. At the midpoint, this role pays about $182k versus about $195k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 575 open roles on FindRole.
Listed pay typically runs $147,900–$221,900 across 550 roles with salary data.
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At a glance
Next-Gen, High-Speed Memory Subsystem ASIC Digital Design Engineer The hardware micro-architects and RTL designers on this team develop SOC Interconnects, Cache, and Memory Controllers for Snapdragon platforms across smartphones, PCs, Chromebooks, VR, AR, and automotive solutions. You will micro-architect, design, and validate RTL for blocks and modules of SOC Interconnects, Interconnect Caches, and memory subsystems. Daily responsibilities include identifying hardware optimizations for performance, power, and cost, evaluating complex algorithm feasibilities, developing specifications, and providing essential verification and debugging throughout project cycles. You will utilize Verilog, SystemVerilog, Synopsys synthesis, and C/C++/Python programming languages. The role requires expertise in Computer Architecture, Computer Arithmetic, and low power design to solve technical challenges in ASIC design, verification, and integration for high-speed memory subsystems and system-level power designs.
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