High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer
Qualcomm
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How this pay compares to similar roles
This role pays less than 72% of similar roles. Most pay $172,000–$218,875 — the shaded band above. At the midpoint, this role pays about $175k versus about $195k for comparable roles.
Based on 240 similar postings.
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Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 623 open roles on FindRole.
Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.
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Next-Gen, High-Speed Memory Subsystem ASIC Digital Design Engineer will join the ASICS Engineering team to develop SOC Interconnects, Cache and Memory Controllers for Snapdragon platforms across mobile, PC, and automotive devices. The role involves micro-architecting, designing, and validating RTL for memory subsystems while optimizing hardware design for performance, power, cost, and clock speed. Daily responsibilities include evaluating complex algorithm feasibility, developing specifications for new generation designs, performing verification and debugging throughout project cycles, and troubleshooting silicon issues. Candidates should possess skills in Verilog, SystemVerilog, Synopsys synthesis, low power design, and coverage-based verification. Preferred technical competencies include Computer Architecture, Computer Arithmetic, and proficiency in C, C++, or Python. The role focuses on solving critical hardware challenges within the memory subsystem domain to improve silicon efficiency for high-performance computing environments.
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