below marketmost similar roles pay hereabove market
This role pays more than
77%
of similar roles. Most pay
$160,367–$255,125
— the blue band above.
At the midpoint, this role pays about
$259k
versus about
$208k
for comparable roles.
Based on 240 similar postings.
Employer
About Lam Research
Lam Research Corporation is a leading American supplier of wafer-fabrication equipment and services to the global semiconductor industry.
Lam Research currently has
137 open roles
on FindRole.
Listed pay typically runs
$114,000–$253,000
across 82 roles with salary data.
JOB TITLE: Dir, Engineering
The Dir, Engineering joins the Global Products Group to lead a global organization responsible for hardware, firmware, and FPGA engineering for equipment control systems across multiple product platforms. This leader owns the strategy, development, qualification, and lifecycle management of control-system products, including new product introduction and obsolescence management. Key responsibilities include driving the delivery of controller platforms, circuit boards, FPGA-based logic, communication interfaces, and sensor systems. The role requires expertise in electronic control systems, board-level design, processor architectures, and real-time embedded systems. Candidates must utilize skills in Verilog, SystemVerilog, VHDL, and industrial communication interfaces like EtherCAT or DeviceNet. This position solves complex technical problems regarding equipment integration, functional safety, and programmable interlocks within the semiconductor capital equipment and industrial automation domain.
Lead a global engineering organization responsible for equipment controls hardware, embedded firmware, and FPGA design.
Own the technology strategy, architecture, roadmaps, and lifecycle management for all control-system products.
Drive the delivery of controller platforms, circuit boards, FPGA-based logic, and communication interfaces.
Manage new product introduction and sustaining engineering, including design reviews, verification, and field deployment.
Execute obsolescence and technology-refresh strategies for hardware components, FPGA devices, and firmware platforms.
Perform system-level root-cause analysis and corrective actions for complex hardware and firmware issues.
Establish engineering practices to improve product reliability, diagnostics, serviceability, and commonality across platforms.
Communicate technical direction, product risks, and release readiness to executive leaders and customers.
What we're looking for
Bachelor’s degree in Electrical, Computer, or Electronics Engineering with 15+ years of experience, or a Master’s with 12+ years, or equivalent experience.
At least 7 years of engineering leadership experience, including leading managers, technical leads, or multidisciplinary teams.
Demonstrated experience leading hardware, embedded firmware, and FPGA-based product development through the full product lifecycle.
Strong knowledge of electronic control systems, board-level design, processor and FPGA architectures, real-time embedded systems, and industrial communication interfaces.
Proven ability to lead system-level troubleshooting and root-cause analysis across hardware, firmware, FPGA, electrical interfaces, and equipment integration.
Strong executive, customer, and cross-functional communication skills to convey technical direction, risks, and recovery plans.
Experience with semiconductor capital equipment, industrial automation, or high-reliability equipment (preferred).
Experience with FPGA design languages, industrial control buses, PCB architecture, and functional safety (preferred).
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