Chip Lead / ASIC Director

Amd

Confirmed live today High trust

Quick summary

Work type: On-site
Location: San Jose, CA
Salary: $248,800–$373,200 / yr
Posted: 152 days ago
Freshness: Confirmed live today
Closes: May 28, 2027
Nearby: 99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $207k

This role $311k

$140k $398k

below market most similar roles pay here above market

This role pays more than 96% of similar roles. Most pay $177,250–$236,262 — the blue band above. At the midpoint, this role pays about $311k versus about $207k for comparable roles.

Based on 240 similar postings.

Employer

About Amd

AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors

Amd currently has 496 open roles on FindRole.

Listed pay typically runs $172,000–$258,000 across 496 roles with salary data.

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At a glance

TL;DR · Chip Lead / ASIC Director

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The Chip Lead / ASIC Director joins the Product Development team to provide technical leadership for one or more Adaptive & Embedded Computing Group device programs. This role carries sign-off responsibility for the technical execution of device programs from initial conception and planning through to manufacturing release. Key responsibilities include managing architecture, RTL, analog and custom design, design for test, verification, physical design, timing closure, and post-silicon validation. The individual must identify critical tradeoffs regarding schedule, cost, size, and power while serving as the engineering interface to Technical Marketing. The role requires a wide breadth of experience in the ASIC design development lifecycle, including FPGA technical experience. Candidates must possess strong interpersonal skills to coordinate solutions across diverse technical teams to resolve complex engineering problems.

Skills

ASIC Design RTL Physical Design Post-silicon Validation FPGA Timing Closure Tapeout Verification Design for Test Architecture Electrical Engineering Computer Engineering

What you'll do

Provide technical leadership for Adaptive & Embedded Computing Group device programs from conception to manufacturing.
Manage technical execution across architecture, RTL, analog design, verification, physical design, and post-silicon validation.
Identify critical architectural tradeoffs and provide feasibility estimates for schedule, cost, size, and power.
Serve as the primary engineering interface to Technical Marketing to ensure products meet customer needs.
Define new device-specific functionality and negotiate for necessary IP versions or variants.
Resolve complex technical issues and guide trade-offs across all phases of the development cycle.
Communicate program changes and their consequences to all relevant stakeholders.
Foster engineering re-use by maintaining awareness of devices and programs throughout the organization.

What we're looking for

Extensive experience with the full ASIC design and development lifecycle.
Proven ability to provide technical leadership for device programs from conception to manufacturing.
Expertise in architecture, RTL, analog/custom design, verification, physical design, and post-silicon validation.
Strong interpersonal and communication skills to coordinate solutions between diverse engineering teams.
Experience in a leadership role with a semiconductor company (preferred).
Master’s or PhD in Electrical Engineering, Computer Engineering, or a related technical field (preferred).
Bachelor’s or Master’s degree in a related discipline (preferred).
Experience in FPGA technical development or post-silicon validation (preferred).

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